Circuit board temperature distribution rapid test method based on small amount of measurement point data

Abstract

The invention provides a circuit board temperature distribution rapid test method based on a small amount of measurement point data, and the method comprises the steps: sorting circuit board power devices from high to low according to the working temperature, and selecting the first s devices as key components of a to-be-tested temperature value; acquiring temperature values of the key componentsby using a thermocouple measurement method; determining the thermal power consumption of each key component; determining the thermal resistance of each key device; obtaining geometric coordinates of each key device; fitting the temperature distribution of the circuit board by taking the parameters of the key devices as input; sorting the circuit board power devices from high to low according to the working temperature, selecting h devices after the s key devices as non-key devices, and collecting parameter data to optimize the temperature distribution of the circuit board; iterating the previous step until the precision of a temperature distribution calculation result of the circuit board meets the requirement; and calculating the temperature value of each point of the circuit board, and drawing a circuit board temperature distribution cloud chart.

Description

[0001] Technical field [0002] The invention provides a method for quickly testing the temperature distribution of a circuit board based on a small amount of measuring point data. This method measures the temperature of a small number of key components on the circuit board, and conducts high-precision analysis of its thermal resistance, thermal power consumption, position and other parameters as the main influencing factors of temperature, so as to quickly test the overall temperature distribution of the circuit board. The invention belongs to the temperature testing and analysis technology of electronic products (including circuit boards). This method can quickly test the temperature distribution of the entire circuit board on the basis of measuring the temperature values ​​of fewer components, and can be widely used in aviation, aerospace, weapons, ships, nuclear industries and other military fields as well as new energy, communication, rail transit, Thermal testing and ther...

AI Technical Summary

Problems solved by technology

[0005] 1) When the size of the circuit board and components is small, it is difficult to measure or the measurement error is large by using contact methods such as resistance thermometers or thermocouples;

[0006] 2) The measurement accuracy of the temperature distribution of the circuit board measured by the non-contact method is limited or the measurement error is relatively large;

[0007] 3) Most of the circuit board temperature test methods focus on the temperature test of individual components, but there is still a lack of test for the temperature distribution of the entire board;

[0008] 4) The simulation analysis method is used to determine the temperature distribution of the circuit board, which often has a long cycle and low efficiency, and is not suitable for application requirements such as rapid response required by engineering

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