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Double-sided polishing method

A technology of double-sided grinding and surface grinding, which can be used in grinding machine tools, grinding devices, grinding/polishing equipment, etc., and can solve problems such as large global shape deviation and wafer flatness deviation.

Active Publication Date: 2020-07-10
SHIN-ETSU HANDOTAI CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the pressure-feeding method, variations in the flatness of the wafer, especially in the global shape, are often found to be large (Patent Document 1, Patent Document 2)

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0047] Focus on image 3 The rotation angle α is 83° and the rotation angle β is 263°. Focusing on the two supply holes of the supply hole 17 and the supply hole 18 that are arranged 500 mm from the center of the platform on the radius R rotated by the rotation angle α and the radius after the rotation angle β, pass The ball valve changes the flow rate of the slurry supplied from these supply holes. Regarding the flow rate of the slurry in the supply hole at other angles, it is implemented in a state that satisfies the above-mentioned formula 1.

[0048] The slurry is supplied to the thirty-six supply holes of the upper platform in a pressure feeding manner. Attach a manual ball valve to the plastic pipe connected to the supply hole, and adjust the flow rate of each supply hole to the degree of opening and closing. Regarding the flow rate measurement of each supply hole, the slurry was supplied for one minute in the same manner as during grinding with the upper platform raised,...

Embodiment 2

[0061] Except that the Diff was 18%, everything else was carried out under the same conditions as in Example 1.

Embodiment 3

[0063] Except that the Diff was 23%, everything else was carried out under the same conditions as in Example 1.

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Abstract

The present invention is a double-sided polishing method for a wafer. In a double-sided polishing device, the wafer is held in a work piece holding hole formed in a carrier and is clamped by utilizingan upper surface plate and a lower surface plate to each of which a polishing pad is affixed, and the double-sided polishing is carried out while a slurry is supplied to a polishing surface by a pressure-feeding system from the supply holes provided in the upper surface plate, wherein polishing is performed while control is carried out, so that the ratio of the absolute value of the difference ofthe average value of the flow rate of the slurry supplied from the supply holes on a radius at one end of an arbitrary straight line on the upper surface plate and the average value of the flow rateof the slurry supplied from the supply holes on a radius at the other end of the arbitrary straight line with respect to the average value xave of the flow rate of the slurry supplied from all the supply holes is 25% or less. The double-sided polishing method for the wafer is thereby provided, which is intended to suppress the variation in the global shape (GBIR) of the wafer in the double-sided polishing device in which slurry is supplied by the force-feeding system, and in which the variation in GBIR can be reduced under the force-feeding system.

Description

Technical field [0001] The present invention relates to a double-sided polishing method. The double-sided polishing method uses a double-sided polishing device in which the slurry supply is a pressure feeding method to perform double-sided polishing in a manner that the distribution of the slurry supply amount to the supply hole conforms to a certain rule Processing to suppress deviations in wafer flatness. Background technique [0002] In double-sided grinding, the typical supply methods of slurry include a slurry ring on the platform temporarily accepts the slurry and flows to the polishing surface with gravity, and the slurry is sent to the polishing surface while applying pressure via a rotary joint. The pressure delivery method. The pressure-feeding method has the advantage of being able to supply an arbitrary amount of slurry to the polishing surface by controlling the pressure of the pump for feeding the liquid. However, variations in the flatness of the wafers in the pr...

Claims

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Application Information

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IPC IPC(8): B24B1/00B24B37/08B24B57/02H01L21/304
CPCB24B37/00H01L21/304B24B37/28B24B57/02B24B37/042H01L21/67092
Inventor 田中佑宜
Owner SHIN-ETSU HANDOTAI CO LTD