Unlock instant, AI-driven research and patent intelligence for your innovation.

Multi-connected full-color integrated module

An integrated module, multi-connected technology, applied in the direction of electrical solid devices, semiconductor devices, printed circuits connected with non-printed electrical components, etc., can solve the problem of low LED placement efficiency, low lamp bead thrust, and hidden quality problems. and other problems, to achieve the effect of improving firm performance, facilitating manual maintenance, and improving product quality

Pending Publication Date: 2020-07-17
ZHEJIANG INTELED OPTOELECTRONICS TECH
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The present invention mainly solves the problems of low mounting efficiency of LEDs in the prior art, low thrust of lamp beads on the screen, hidden quality problems, and high maintenance costs; it provides a multi-connected full-color integrated module, which can improve mounting efficiency, Reduce the difficulty and cost of maintenance, enhance the thrust of LED chips, and improve product quality

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Multi-connected full-color integrated module
  • Multi-connected full-color integrated module
  • Multi-connected full-color integrated module

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0025] A multi-connected full-color integrated module, such as figure 1 , figure 2 As shown, it includes a support substrate and several LED chips arranged on the substrate. The material of the support substrate is BT material or glass fiber material or glass fiber paper-based composite material or metal-based copper-clad material. The support substrate adopts a bowl-free structure, and the support substrate adopts a 1-8-layer circuit board.

[0026] The LED chips form a square array on the support substrate, and the square array of LED chips is arranged as 8 rows*8 columns or 9 rows*8 columns or 16 rows*16 columns or 18 rows*16 columns or 18 rows*18 columns. In this embodiment, the square array of LED chips is 9 rows*8 columns. Array arrangement is adopted, and the mounting of an array of LEDs can be completed once in the full-color integrated module, which greatly improves the efficiency of SMT.

[0027] The LED chips are lined up in an array on the support substrate. Wh...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a multi-connected full-color integrated module which aims to overcome the problems that in the prior art, the LED surface mounting efficiency is low, the thrust of lamp beads on a screen is not high, the potential quality hazards exist, and the maintenance cost is high. The multi-connected full-color integrated module comprises a support substrate and a plurality of LED chips arranged on the substrate, the LED chips form a square array on the support substrate, each LED chip comprises three-color light emitting units, and the three-color light emitting units are respectively a red light emitting unit, a green light emitting unit and a blue light emitting unit. The anodes of the three-color light-emitting units in the same column of LED chips are connected, the cathodes of the red light-emitting units in the same row of LED chips are connected, the cathodes of the green light-emitting units in the same row of LED chips are connected, and the cathodes of the bluelight-emitting units in the same row of LED chips are connected. The LED chips are integrated into one module in an array arrangement manner, so that the mounting efficiency can be improved, the maintenance difficulty and cost are reduced, the thrust of the LED chips is enhanced, and the product quality is improved.

Description

technical field [0001] The invention relates to the field of LED display screens, in particular to a multi-connected full-color integrated module. Background technique [0002] The traditional LED display screen is composed of many single-pixel LED lamp beads corresponding to a certain dot pitch. In the current display manufacturing process, SMT, or surface mount, is a very important process. Each lamp bead needs to be pasted on the display PCB board through the SMT process, and one LED lamp bead needs to be mounted once. , relatively speaking, the efficiency is not very high, and the mounting cost is relatively high. [0003] Secondly, the existing SMD LED lamp beads have only 4 pins, and the total area of ​​the pins and the PCB pads is small. After mounting, the thrust on the PCB is not high, and it is easy to be knocked off during production and handling. The material will have a great impact on the quality of the screen body, and there are hidden dangers in the quality...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L25/075H01L33/48H01L33/62H05K1/18
CPCH01L25/0753H01L33/486H01L33/62H05K1/181H01L2933/0033H01L2933/0066
Inventor 李海欧锋张宏
Owner ZHEJIANG INTELED OPTOELECTRONICS TECH