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Laser chip test platform

A technology of chip testing and spectrum testing, which is applied in the field of laser chip testing platform, can solve the problems of inability to meet large-scale high-efficiency production, long optical coupling time of translation stage, and low production efficiency, so as to provide testing efficiency and meet the requirements of optical power testing , low cost effect

Pending Publication Date: 2020-07-24
镭神技术(深圳)有限公司
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Problems solved by technology

[0002] At present, the laser chip test platforms on the market basically use sub-micron precision displacement stages and integrating spheres to collect light. This solution is expensive, and the optical coupling time of the displacement stage is long, resulting in low production efficiency and cannot meet the requirements of large-scale and efficient production. need

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Embodiment Construction

[0020] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and implementation examples. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0021] It should be noted that all directional indications (such as up, down, left, right, front, back, ...) in the embodiments of the present invention are limited to relative positions on the specified view, rather than absolute positions.

[0022] In addition, in the present invention, descriptions such as "first", "second" and so on are used for description purposes only, and should not be understood as indicating or implying their relative importance or implicitly indicating the quantity of indicated technical features. Thus, the features defined as "first" and "second" may explici...

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Abstract

The invention relates to the technical field of test equipment. The invention particularly relates to a laser chip test platform. A test light receiving device, an XY-axis chip carrying table, an adjustable probe table and an image acquisition device are all fastened on test equipment through bolts, and are all connected to a control system of the test equipment; the test light receiving device comprises a light power detector; the optical power detector is connected to an optical power test system of the test equipment and is used for testing the optical power of a laser chip; and the test light receiving device comprises a coupling lens and a multimode optical fiber, wherein one end of the multimode optical fiber is connected to the coupling lens, and the other end of the multimode optical fiber is connected to the spectrum analyzer and is used for testing the spectrum of the laser chip. Compared with the prior art, the laser chip test platform couples the laser chip with the multimode optical fiber by adopting the coupling lens, the structural design ensures the precision, precise optical alignment is not needed, the test time is greatly shortened while the cost is reduced, andthe test efficiency is improved.

Description

【Technical field】 [0001] The invention relates to the technical field of testing equipment, in particular to a laser chip testing platform. 【Background technique】 [0002] At present, the laser chip test platforms on the market basically use sub-micron precision displacement stages and integrating spheres to collect light. This solution is expensive, and the optical coupling time of the displacement stage is long, resulting in low production efficiency and cannot meet the requirements of large-scale and efficient production. need. 【Content of invention】 [0003] In order to overcome the above problems, the present invention proposes a laser chip testing platform that can effectively solve the above problems. [0004] A technical solution provided by the present invention to solve the above technical problems is to provide a laser chip test platform for testing the optical power and spectrum of the laser chip in the test equipment, including a test light receiving device f...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01J1/42G01J3/28G01J3/02G05D23/24
CPCG01J1/42G01J3/0208G01J3/0218G01J3/28G05D23/1919G05D23/24
Inventor 李伟罗骏
Owner 镭神技术(深圳)有限公司