Miniature uniaxial strain applying device for one-dimensional and two-dimensional nano materials

Abstract

The invention discloses a miniature uniaxial strain applying device for one-dimensional and two-dimensional nano materials. The device comprises a stroke lifting table, a pressing piece, substrate supporting assemblies, a stroke lifting table fixing bracket and a flat plate base. The height of the stroke lifting table is controlled by rotating a knob on the stroke lifting table, then the height ofthe pressing piece is controlled, then a four-point stress applying mode can be formed on a strip-shaped elastic substrate in cooperation with the two fixed substrate supporting assemblies, and thenthe effect of applying uniaxial strain to the strip-shaped elastic substrate is achieved. When a sample is attached to the upper surface of the substrate, uniaxial tensile stress is applied; and whenthe sample is attached to the lower surface of the substrate, uniaxial compressive stress is applied. In addition, digital scales are marked on the stroke lifting table, and the lifting height of thepressing piece can be visually controlled and recorded. Therefore, the uniaxial tension or uniaxial compression stress applying device is simple to operate, uniform and controllable in deformation quantity and excellent in strain effect.

Description

technical field [0001] The invention relates to a uniform and controllable uniaxial strain applying device for one-dimensional and two-dimensional nanometer materials. Background technique [0002] As early as the 1950s, it was discovered that the mobility of crystalline silicon can be greatly improved by applying stress to crystalline silicon, and it has achieved great commercial value in practical applications. However, due to the limitations of technical conditions and material preparation at that time, the overall development of strain engineering was in a tepid state. Until the beginning of the new century, with the rise of nanomaterials, it was found that semiconductor nanomaterials have very significant structural elasticity and rupture ultimate strength due to their extremely small scale, large body-to-surface ratio and high crystal quality. This provides a new possibility for modulating the physical properties of materials by precisely manipulating the stress. Amon...

AI Technical Summary

Problems solved by technology

[0004] The equipment of this control method all adopts the method of two-point bending to apply strain to the substrate. Tension and compression of the substrate, that is, the switching of the stress and tension applied to the substrate cannot be achieved

In addition, these strain devices are large in size and cannot be well matched with the existing microfluorescence spectroscopy testing system, so there is a lot of room for improvement and improvement

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