Insulating film, insulating conductor and metal base substrate
An insulating film and volume technology, applied in the direction of insulating conductors, insulators, insulators, etc., can solve the problem of lowering the withstand voltage of the insulating film, and achieve the effects of high withstand voltage, high thermal conductivity, chemical resistance and mechanical properties.
Active Publication Date: 2022-08-05
MITSUBISHI MATERIALS CORP
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- Description
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Problems solved by technology
[0019] However, as described in the above-mentioned Non-Patent Document 1, the insulating film to which fine particles are added has the problem that the withstand voltage is lowered.
Method used
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Examples
Experimental program
Comparison scheme
Effect test
Embodiment
[0087] Next, the effects of the present invention will be described based on examples.
[0088] [Inventive Examples 1 to 19, Comparative Examples 1 to 8]
[0089] Using the production method shown in Table 1, an insulating film containing inorganic particles and a resin was produced. The specific production method of the insulating film produced in each of the present invention examples and the comparative examples is as follows.
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Abstract
The insulating film (10) comprises: a resin (11) composed of polyimide or polyamideimide or a mixture thereof; and α-alumina single crystal particles (12) having an average particle diameter of 0.3 μm or more and 1.5 μm The content of the α-alumina single crystal particles ( 12 ) is in the range of not less than 8% by volume and not more than 80% by volume within the following range. The insulated conductor (20) is an insulated conductor (20) having a conductor (21) and an insulating film arranged on the surface of the conductor, and the insulating film is composed of the above-mentioned insulating film (10). The metal base substrate (30) is a metal base substrate (30) formed by laminating a metal substrate (31), an insulating film and a metal foil (33) in this order, and the insulating film is composed of the insulating film (10).
Description
technical field [0001] The present invention relates to an insulating film, an insulating conductor using the insulating film, and a metal base substrate. [0002] The present application claims priority on Patent Application No. 2018-018268 filed in Japan on February 5, 2018 and Patent Application No. 2018-246997 filed in Japan on December 28, 2018, the contents of which are incorporated herein by reference. Background technique [0003] The insulating film is used, for example, as an insulating film used for an insulating conductor in a coil or a motor, a protective film for protecting the surface of electronic components such as semiconductor chips and LED elements, or a circuit board, and an insulating film for a metal base substrate. [0004] As the insulating film, a film formed of a resin composition containing a resin and an inorganic filler is used. As the resin, a resin having high heat resistance, chemical resistance, and mechanical strength, such as polyimide or...
Claims
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IPC IPC(8): H01B3/30C08L79/08H01B3/00H01B7/02H01B17/62H05K1/05
CPCC08L79/08C08G73/1046C08K3/22H01B3/006H01B3/306H05K1/056H05K3/022H05K2201/0209H05K3/386C08K2201/003C08K2003/2227C08G73/14H01B7/02C08J5/18H05K1/05C08J2379/08H01B17/62H01B17/66
Inventor 石川史朗山﨑和彦伯德烈·盖布瑞欧
Owner MITSUBISHI MATERIALS CORP