MCU processor and packaging method thereof

Abstract

The invention belongs to the field of integrated circuit design and application, and discloses an MCU processor and a packaging method thereof, and the MCU processor comprises a domestic CPU, a FLASH,an FPGA, an EEPROM, and a power management module. The CPU is connected with the FLASH through an SPI (Serial Peripheral Interface) to finish the expansion of the embedded storage space; wherein a configuration operation register and a plurality of expansion interfaces are arranged on the FPGA, the configuration operation register is connected with a memory controller interface of the CPU, and the plurality of expansion interfaces are connected with the configuration operation register; wherein the EEPROM is connected with an EEPROM interface of the FPGA, a power supply is input into the power supply management module, and the output end of the power supply management module supplies power to the LCR3209 processor, the FLASH, the FPGA and the EEPROM. Compared with an existing single-chipcircuit and SIP integrated module, the MCU processor can meet the requirements for high dominant frequency and high performance, can also meet the requirements for a communication interface and a control interface in equipment updating and upgrading, can achieve power supply of a single power source, reduces power consumption, and meets the requirements for localization, universality, high performance, high reliability, low cost and low power consumption.

Description

technical field [0001] The invention belongs to the field of integrated circuit design and application, and relates to an MCU processor and a packaging method thereof. Background technique [0002] With the rapid development of equipment control requirements, the demand for the communication interface and control interface of the processor has been greatly increased in the equipment update and upgrade, and the existing processor integrated modules, such as single-chip or SIP integrated modules, have been brought along. Neither can meet the needs of new product development and upgrading. [0003] see figure 1 and 2 , a functional block diagram of an existing monolithic circuit and a SIP integrated module. First of all, due to the defects of design technology and implementation technology, it is difficult for single-chip circuits to integrate the required communication interfaces and storage space. Requirements for external interfaces, storage space, and power supply. Sec...

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Problems solved by technology

[0004] The purpose of the present invention is to overcome that the existing integrated processor module in the prior art cannot meet the requirements for processor performance, communication interface and control interface in equipment updating and upgrading, the complicated power supply is not conducive to system integration, and the use of substrate space is not large , It is not easy to guarantee the shortcomings of the product quality level, providing an MCU processor and its packaging method

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