Metal-based printed circuit board

A printed circuit board, metal-based technology, used in printed circuits, printed circuit manufacturing, printed circuit components, etc., can solve the problem that the thermal conductivity of the insulating layer cannot effectively utilize the heat dissipation capacity of the metal-based electronic components, and achieve accelerated heat dissipation. The rate of heat dissipation, the effect of accelerating heat exchange and enhancing heat dissipation capacity
CN111479382AInactive Publication Date: 2020-07-31合肥科塑信息科技有限公司

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
合肥科塑信息科技有限公司
Publication Date
2020-07-31
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention belongs to the technical field of printed circuit board preparation, and particularly relates to a metal-based printed circuit board, which is characterized in that uniformly distributedmounting holes are formed in one side, close to an insulating layer, of a metal base layer; the mounting hole is designed in a step shape; the metal base layer is fixedly connected with a heat conduction column through the mounting hole; the heat conduction column is made of beryllium oxide ceramic materials; the heat conduction column penetrates through the insulating layer; the end, close to the copper-clad layer, of the heat conduction column is designed to be in a T shape; a conduction hole is formed in the heat conduction column; the via holes are formed in the horizontal direction; theconducting holes are filled with heat conducting wires; the heat conduction wire is made of a heat conduction silica gel material; and the through holes are formed in the two ends of the heat conduction column; the heat conduction columns made of the beryllium oxide ceramic material and arranged in the insulating layer have high heat conduction performance, so that heat is rapidly conducted by theheat conduction columns and transmitted to the metal base layer, the metal base layer is used for dissipating the heat, and the transverse heat dissipation capacity of the printed circuit board is achieved.
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Description

technical field

[0001] The invention belongs to the technical field of printed circuit board preparation, in particular to a metal-based printed circuit board. Background technique

[0002] Printed circuit board, also known as printed circuit board, is a provider of electrical connections for electronic components, and its development has a history of more than 100 years; its design is mainly layout design; the main advantage of using circuit boards is that it greatly reduces wiring and assembly errors, which improves the automation level and production labor rate. The metal-based printed circuit board is mainly composed of a metal base layer, an insulating layer and a copper clad layer. Since the printed circuit board is mainly used to provide power lines and support platforms for welding electronic components , when the electronic components work on the printed circuit board, some electronic components will dissipate a large amount of heat, thus putting forward certain req...

Claims

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