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Process for removing material from a surface

A stripping and patterning technology, used in lasers, laser optical equipment, laser welding equipment, etc., can solve problems such as interference and unusability, and achieve the effect of improving surface quality

Active Publication Date: 2020-08-07
TRUMPF LASER GMBH CO KG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This can be problematic when combined with newer laser systems, which are actually capable of higher pulse powers and fluences, but which are unusable due to the resulting interference geometry

Method used

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  • Process for removing material from a surface
  • Process for removing material from a surface
  • Process for removing material from a surface

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0047] figure 1 A schematic diagram of an embodiment of a laser system 100 is shown, which is used to implement the method for stripping material from a surface which will be described in detail below.

[0048] Within the scope of an embodiment of the method, the material is stripped from the surface by means of the laser system 100, wherein, in the first stripping mode, the surface is loaded with at least one low-frequency laser pulse sequence of the laser system 100, preferably It is a low-frequency single pulse sequence and loads a high-frequency pulse group on the surface in the second stripping mode, wherein the single pulse repetition rate of a single laser pulse in the high-frequency pulse group is at least 0.5 GHz to a maximum of 100 GHz.

[0049] The duration of the high-frequency pulse group is preferably at least 10 ns to at most 10 μs. Alternatively or additionally, the high-frequency pulse group preferably includes at least 5 individual laser pulses. Preferably, the h...

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Abstract

The invention relates to a method for removing material from a surface, whereby material is removed from the surface by means of at least one laser system (100). In order to remove material from the surface, a) in a first removal mode, at least one low frequency laser pulse train (140) of the at least one laser system (100) is loaded on the surface, and b) in a second removal mode, high-frequencypulse packets (170) are applied, a single pulse repetition rate of individual laser pulses (160) in the high-frequency pulse packets (170) of at least 0 .5 GHz to a maximum of 100 GHz.

Description

Technical field [0001] The invention relates to a method of stripping material from a surface. Background technique [0002] In such methods, material is stripped from the surface by means of at least one laser system. Here, the increase in the amount of material stripped per unit of time by power changes is generally defined by the surface heating effect. In particular, the waste heat in the material is based on the large temperature gradient which causes the melting power to freeze quickly due to the available heat transfer. If you need to avoid disturbing the geometry on the surface, limit the available flux and the achievable pulse energy. That is, just when the flux of a single pulse of the laser system is high and / or the single pulse repetition rate is high, a cone-like protrusion (Cone-Like-Protrusions-CLP) is formed, which forms a foam-like structure and thereby reduces The surface quality of the treated surface. This can be problematic when combined with newer laser ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/36B23K26/0622
CPCB23K26/36B23K26/0622B23K26/352H01S3/005H01S3/0085H01S3/0092B23K26/0006B23K26/354B23K26/355B23K26/362B23K26/402B23K26/40B23K2101/40B23K2103/05B23K2103/56B23K26/0624
Inventor M·赛勒A·布德尼茨
Owner TRUMPF LASER GMBH CO KG