Three-way vibration test sensor based on additive manufacturing technology and preparation method

A technology of vibration testing and additive manufacturing, applied in the field of testing, can solve the problems of difficult to achieve uniform molding of composite materials, complicated preparation process, backward preparation process, etc., and achieve the effect of consistent structure and performance, easy to carry, and a wide range of sources.

Pending Publication Date: 2020-08-07
JILIN UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The preparation methods of traditional sensors generally have some shortcomings, such as the complicated preparation process and backward prep

Method used

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  • Three-way vibration test sensor based on additive manufacturing technology and preparation method
  • Three-way vibration test sensor based on additive manufacturing technology and preparation method
  • Three-way vibration test sensor based on additive manufacturing technology and preparation method

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Example Embodiment

[0053] Such as Figure 1 to Figure 3 As shown, the three-way vibration test sensor based on additive manufacturing technology of the present invention is composed of a base A, a vibration test component B, a sensor housing C, and a data management module D. The base A is composed of a chassis 1, a middle plate 2 and a center rod 3. It consists of the chassis 1, the middle plate 2 and the center rod 3 in order from bottom to top and is fixedly connected; the central hole 6 of the cylinder 13 in the vibration test component B is fixedly connected to the central rod 3 of the base A, and the lower end of the sensor housing C is fixedly connected On the top of the middle plate 2 in the base A; the data input terminal of the vibration signal acquisition card 35 in the information management module D and the sensing components Ⅰ4, Ⅲ8, Ⅱ10, Ⅳ11, Ⅴ15 and The data transmission interface 21 of the sensor component VI17 is connected in communication.

[0054] Such as Figure 4 As shown, the ...

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Abstract

The invention discloses a three-way vibration test sensor based on an additive manufacturing technology and a preparation method, and belongs to the technical field of detection. A center hole of a cylinder in a vibration test assembly of the three-way vibration test sensor based on the additive manufacturing technology is fixedly connected with a center rod of a base, and the lower end of a sensor shell is fixedly connected to a middle disc in the base. A data input end of a vibration signal acquisition card in the information management module is in communication connection with a data transmission interface of each induction assembly in the vibration test assembly, and a piezoelectric layer and a packaging body are manufactured by taking vibration guide liquid as a vibration conductionmedium and adopting an additive manufacturing technology. According to the invention, vibration wave conduction can be continuously carried out, the piezoelectric layer has high conductivity and sensitivity, the quality and quantity of collected vibration signals are optimized and improved, the manufacturing process is simple, and the cost is low.

Description

technical field [0001] The invention belongs to the technical field of detection, and in particular relates to a three-way vibration test sensor based on additive manufacturing technology and a preparation method. Background technique [0002] The vibration measurement sensor is an important branch of a wide variety of sensors. Its function is to quantitatively convert the vibration displacement, vibration velocity and vibration acceleration caused by vibration into electrical signals, record them and feed them back to the user. Due to the limitations of the development of material science and electronic measurement technology, the common vibration sensors today include fiber grating vibration sensors, piezoelectric vibration sensors and capacitive vibration sensors. Most of these types of sensors are based on traditional metal materials and semiconductor materials. There are some obvious deficiencies in manufacturing, such as: complex manufacturing process, not simple struc...

Claims

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Application Information

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IPC IPC(8): G01H11/08H01L41/113H01L41/23H01L41/29H01L41/35
CPCG01H11/08H10N30/302H10N30/02H10N30/06H10N30/09
Inventor 齐江涛丛旭张志辉胡小鹿杨新宇信仁龙田辛亮孙会彬李茂刘凯
Owner JILIN UNIV
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