MEMS probe single-rotating-shaft symmetrical bending test structure and pitching arm thereof

A technology for symmetrical bending and testing structures, applied in the direction of testing material strength by applying stable bending force, testing material strength by applying stable tension/pressure, measuring devices, etc., can solve difficult heat dissipation problems, MEMS probe card technology New, narrow field and other issues

Active Publication Date: 2020-08-07
MAXONE SEMICON CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] However, no special testing equipment has been found for testing the properties of palladium alloy probes.
This situation is not only due to the new MEMS probe card technology and narrow field, it is difficult to have general-purpose equipment for direct application, but also it is difficult to manufacture special test equipment for testing the

Method used

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  • MEMS probe single-rotating-shaft symmetrical bending test structure and pitching arm thereof
  • MEMS probe single-rotating-shaft symmetrical bending test structure and pitching arm thereof
  • MEMS probe single-rotating-shaft symmetrical bending test structure and pitching arm thereof

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Experimental program
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specific Embodiment approach 1

[0103] The following is a specific embodiment of the MEMS palladium alloy probe testing device of the present invention.

[0104] The MEMS palladium alloy probe testing device under the present embodiment, the structure schematic diagram is as follows figure 1 shown. The MEMS palladium alloy probe testing device comprises a barrel-shaped housing 1, a disturbance structure 2 arranged on the inner wall of the barrel-shaped housing 1, an electromagnetic pole 3 arranged on the outer wall of the barrel-shaped housing 1, and arranged horizontally in the barrel-shaped housing 1 Placed reference test platform 4, a symmetrical bending test structure 5 positioned above the reference test platform 4, a sealing cover 6 arranged above the barrel-shaped housing 1 and a sensor 7 installed on the sealing cover 6, a sprayer 8, a heater 9 and fan 10;

[0105] The disturbance structure 2 includes a disturbance body 2-1 with a circular cross section, a roller 2-2 and a tooth structure 2-3 dispo...

specific Embodiment approach 2

[0112] The following is a specific embodiment of the MEMS palladium alloy probe testing device of the present invention.

[0113] The MEMS palladium alloy probe test device under the present embodiment, on the basis of the specific embodiment one, further defines that the benchmark test platform includes a main board 4-1 and a plurality of sliders 4-2, and the main board 4-1 is provided with There are gaps from both sides to the center of symmetry, the cross-sectional shape of the gap is "I" shape, a slider 4-2 is inserted in the gap, and a plurality of vertical shafts are equally spaced on the slider 4-2 A circular through hole in a straight direction, the through hole can be equipped with a lifting structure 5-9, such as image 3 Shown; The material of described main board 4-1 and slide block 4-2 is different, specifically as follows:

[0114] First, the speed at which the volume of the material of the main board 4-1 increases with the increase of temperature is lower than ...

specific Embodiment approach 3

[0120] The following is a specific implementation of the benchmark test platform in the MEMS palladium alloy probe test device of the present invention.

[0121] The benchmark test platform under the present embodiment includes a main board 4-1 and a plurality of sliders 4-2, the main board 4-1 is provided with a gap from both sides to the symmetrical center direction, and the cross-sectional shape of the gap is "I" shape, a slider 4-2 is inserted in the gap, and a plurality of circular through holes in the vertical direction are equally spaced on the slider 4-2, and the through holes can be installed with a lifting structure 5- 9, such as image 3 Shown; The material of described main board 4-1 and slide block 4-2 is different, specifically as follows:

[0122] First, the speed at which the volume of the material of the main board 4-1 increases with the increase of temperature is lower than that of the material of the slider 4-2 with the increase of temperature. Before testi...

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Abstract

The invention discloses an MEMS probe single-rotating-shaft symmetrical bending test structure and a pitching arm thereof, and belongs to the field of IC manufacturing industry. The MEMS probe single-rotating-shaft symmetrical bending test structure is sequentially provided with a first main rotating shaft, a first shaft adapter piece, a cross adapter piece, a second shaft adapter piece and a second main rotating shaft from top to bottom, and the first main rotating shaft, the first shaft adapter piece, the cross adapter piece, the second shaft adapter piece and the second main rotating shaftare symmetrical up and down relative to the cross adapter piece. A rotatable left pitching arm is coaxially mounted at the left end of the cross-shaped adapter, and a rotatable right pitching arm is coaxially mounted at the right end of the cross-shaped adapter. Lifting rods are mounted at the outer end parts of the left pitching arm and the right pitching arm through rotating shafts, the lower end parts of the lifting rods are connected to the top end of the lifting structure, and the lifting structure moves up and down. The structure can test the tensile property and the bending property ofa plurality of probe cards with different sizes at the same time, because only one motor is needed for realization, the condition that a plurality of driving devices are crowded under a small size isavoided, and the heat dissipation problem of the MEMS device is further solved.

Description

technical field [0001] The invention discloses a MEMS probe single-axis symmetrical bending test structure and its pitch arm, which belong to the field of IC manufacturing industry, and specifically relate to a device, method and related key technologies for performance testing of palladium alloy probes in MEMS probe cards. Background technique [0002] The probe card is a very important technology in the chip manufacturing process. Before the chip is packaged, the probes on the probe card directly contact the pads or bumps on the chip to lead out the chip signal, and then cooperate with peripheral testing instruments and Software control realizes automatic measurement, and then screens out defective products to ensure product yield. [0003] With the development of micro-electromechanical system (MEMS) technology, the size of the chip is getting smaller and smaller, reaching the order of millimeters, and the degree of integration inside the chip is getting higher and higher...

Claims

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Application Information

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IPC IPC(8): G01N3/02G01N3/08G01N3/20
CPCG01N3/02G01N3/08G01N3/20G01N2203/0017G01N2203/0023G01N2203/005
Inventor 于海超周明赵梁玉刘明星
Owner MAXONE SEMICON CO LTD
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