Integrated device

Abstract

The invention provides an integrated device. Compared with the traditional integrated device adopting welding and bonding, the integrated device provided by the embodiment of the invention has the advantages that repeated disassembly and assembly can be realized, the maintenance of circuit boards is facilitated, the manufacturing cost is low, the accurate alignment connection of two circuit boardscan be realized, and the assembly precision is high. According to the invention, the contact area of an electric conductor and a bonding pad can be increased through a protruding part arranged on theelectric conductor, so that the electric conductor and the bonding pad are in more sufficient contact, and the problems of circuit interruption or signal distortion and the like of the integrated device can be avoided; the protruding part can also increase the friction force between the electric conductors and the bonding pad, so that the electric conductor and the bonding pad are not easy to misplace in the assembly process of the integrated device, and the reliability of electric connection between the two circuit boards is ensured; and due to the arrangement of the adapter plate, the distance between two adjacent circuit boards can be increased, so that components on the circuit board have enough accommodating space.

Description

technical field [0001] The invention relates to the technical field of circuit connection, in particular to an integrated device. Background technique [0002] In the electronics industry, electronic components such as chips and circuit boards are usually connected by soldering (BGA) or conductive glue. Although welding has the advantage of reliable connection, it also has the disadvantage of being unable to be disassembled repeatedly. If there is an operation error during the welding process, or there is a problem such as poor electrical conductivity after welding, the electronic components that are welded can only be reworked or directly reworked with more resources. scrapped, resulting in material waste and cost increase; although conductive adhesive connection is easier to implement than welding, and is convenient for rework and maintenance, due to some problems of conductive adhesive itself, as well as external factors such as climate, aging, stress and strain, etc. In...

AI Technical Summary

Problems solved by technology

Although welding has the advantage of reliable connection, it also has the disadvantage of not being able to be disassembled repeatedly. If there is an operation error in the welding process, or poor electrical conductivity after welding, the soldered electronic components can only spend more resources on rework or direct scrapped, resulting in material waste and cost increase; although conductive adhesive connection is easier to implement than welding, and is convenient for rework and maintenance, due to some problems of conductive adhesive itself, as well as external factors such as climate, aging, stress and strain, etc. Influence, the conductivity of the conductive adhesive is not stable enough, therefore, the problem of circuit interruption or signal distortion is prone to occur between electronic components connected by conductive adhesive

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