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A curative composition and a resin composition containing the curative composition

A composition and compound technology, which is applied in the field of latent curing agent compositions, can solve the problems of inability to use single-component epoxy resin compositions, hindering high-volume application of composite matrix preparations, and expensive curing clathrates.

Pending Publication Date: 2020-08-07
HEXCEL COMPOSITES SAS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Unfortunately, these curing agents are very reactive, so mixed solutions of epoxy resins and these curing agents have the problem that they show an earlier cure onset temperature and therefore cannot be used as point-of-use manufacture and then Delivered one-part epoxy compositions as these will thicken, gel and cure during shipping or storage
[0014] Furthermore, known curing clathrates are expensive to manufacture and this prevents their widespread use in high volume applications of composite matrix formulations in numerous applications including wind energy applications, automotive applications and marine applications

Method used

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  • A curative composition and a resin composition containing the curative composition
  • A curative composition and a resin composition containing the curative composition
  • A curative composition and a resin composition containing the curative composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0186] Embodiments of the invention are described below, by way of example only, with reference to the following examples.

[0187] The following constituent components were used to prepare the compositions of the examples.

[0188]

[0189]

[0190] The following methods were used to measure various parameters of the cured resin:

[0191] Dynamic Differential Scanning Calorimetry (DSC) was performed using a TA Q100 instrument to determine the uncured glass transition temperature (Tg) according to ASTM D7028, cure onset temperature T c , and reactivity and residual cure obtained from -50 to 350°C using a heating rate of 10°C / min.

[0192] Isothermal Differential Scanning Calorimetry (DSC) was performed using a DSC 1 from a Mettler Toledo instrument to determine the time to 95% cure at various temperatures and cure regimes.

[0193] Dynamic Mechanical Analysis (DMA) was performed on the cured resin using a Q800 instrument at a heating rate of 5°C / min and a frequency of ...

Embodiment 1-B

[0201] Example 1 - BHPVA-2E4MZ

[0202] 10.0 g of 4,4'-bis(4'-hydroxyphenyl)valeric acid were stirred in 150 ml of refluxing acetone. A solution of 3.85 g of 2-ethyl-4-methylimidazole in 15 ml of acetone was added dropwise to the solution. The mixture was refluxed for 3 hours, then allowed to cool to room temperature. The resulting precipitate was collected by filtration and allowed to dry in a vacuum oven at room temperature overnight to yield 12.3 g of a white powder. The ratio of host to guest in the precipitated clathrate is determined by 1 H NMR showed about 1:1, which equates to 27.8 wt% imidazole.

Embodiment 2-B

[0203] Example 2 - BHPVA-2MZ

[0204] BHPVA-2MZ was prepared using the procedure in Example 1 with 10.0 g of 4,4'-bis(4'-hydroxyphenyl)valeric acid and 2.9 g of 2-methylimidazole to give 12.9 g of a white powder. The ratio of host to guest in the precipitated clathrate is determined by 1 H NMR showed about 1:1, which equates to 22.3 wt% imidazole.

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Abstract

This invention relates to a curative composition and its use in curing epoxy resins and prepregs, adhesives and moulded materials derived therefrom. The curative composition comprises a clathrate comprising a host component and a guest component, the host comprising a carboxylic acid or ester compounds as defined or phenolphthalin and the guest comprising an imidazole or imidazoline component.

Description

technical field [0001] The present invention relates to curing agent compositions and materials comprising curing agent compositions, particularly but not exclusively to latent curing agent compositions comprising host components and guest components, which can be used as molding compounds, adhesives and the curing agent composition in the resin matrix composition in the prepreg. The present invention relates to such compositions and articles made therefrom. Background technique [0002] Composite materials are produced in many forms. A fiber layer impregnated with a curable resin matrix formulation is referred to in this application as a prepreg. Molding compounds generally comprise a combination of fiber material in chopped, isotropic or quasi-isotropic form and a resin matrix formulation. The resin matrix formulations in these materials can be uncured or partially cured. [0003] The resin matrix formulation can be selected from a wide range of polymerizable component...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J3/24C08G59/50C08K9/10C08L63/00C08G59/40
CPCC08G59/40C08G59/50C08K9/10C08L63/00C08J2363/00C08J5/243C08J3/24C08J3/241C08K5/3445C08K5/13C08K5/09
Inventor D·蒂尔布鲁克C·梅森M·西蒙斯
Owner HEXCEL COMPOSITES SAS
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