Power cycle test device and system for semiconductor device

A power cycle and test device technology, applied in the field of power cycle test devices and systems, can solve the problems that the control of junction temperature and case temperature does not meet the experimental requirements, the test device is easy to age, and the cost is high, so as to achieve long service life and high reliability , cost reduction effect

Active Publication Date: 2020-08-11
THE 13TH RES INST OF CHINA ELECTRONICS TECH GRP CORP
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Problems solved by technology

[0005] In view of this, the embodiment of the present invention provides a power cycle test device and system for semiconductor devices to solve the problems that the control of junction temperature and case temperature in traditional power cycle tests does not meet the experimental requirements, and the test device is prone to aging and high cost.

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  • Power cycle test device and system for semiconductor device
  • Power cycle test device and system for semiconductor device
  • Power cycle test device and system for semiconductor device

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Embodiment Construction

[0048] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0049] see figure 1 A power cycle test device for a semiconductor device provided in an embodiment of the present invention is used for reliability tests of power electronic devices, and mainly supports power cycle tests of SMD (Surface Mounted Devices, surface mount) packaged high-power power electronic devices, It is suitable for semiconductor devices with high current and high power above 200A, such as power diodes, MOS tubes, IGBTs, etc.

[0050] The device mainly includes: base 100, electrode equipment 200, device positioning frame 300, elastic briquetting eq...

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Abstract

The invention belongs to the field of semiconductor testing, and provides a power cycle test device and system for a semiconductor device. The system comprises an industrial personal computer, power-up equipment, a thermal tester and a test device. The device comprises a base, electrode equipment, a device positioning frame, elastic briquetting equipment and temperature detection equipment; the power-up equipment circularly powers up the electrode equipment within a preset period number; the thermal tester acquires the voltage of the tested device, and determines a junction temperature corresponding to the voltage of the tested device according to a pre-calibrated voltage junction temperature curve; the industrial personal computer controls the power-up equipment to circularly power up theelectrode within the preset period number; the shell temperature and the junction temperature of the tested device are also obtained; and when any one of the shell temperature, the junction temperature and the junction temperature variation does not meet a preset temperature condition, the power-up equipment is controlled to stop working, the power cycle test is ensured to be carried out smoothly, and the reliability is high. Meanwhile, the mechanical structure is used for fastening, the problems of damage, connection falling, aging and the like are avoided, high current can be tolerated, andthe service life is long.

Description

technical field [0001] The invention belongs to the field of semiconductor testing, and more specifically relates to a power cycle testing device and system for semiconductor devices. Background technique [0002] Power electronic devices are concentrated in the three major product areas of motor drive, charging and discharging, and power conversion. With the development of the third-generation semiconductor technology and the new energy vehicle industry, power electronic devices have also ushered in new development opportunities, and the market demand has grown rapidly , only for new energy vehicles, the annual domestic demand for automotive-grade IGBT modules is several million, and power electronic devices are gradually becoming a hot spot in the semiconductor industry. [0003] The rapid development of related industries provides a broad market demand for the reliability test of power electronic devices. Life test is currently the most commonly used and most effective r...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/26
CPCG01R31/2601
Inventor 迟雷桂明洋高蕾黄杰彭浩高金环陈龙坡张瑞霞
Owner THE 13TH RES INST OF CHINA ELECTRONICS TECH GRP CORP
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