Surface acoustic wave switch filtering module based on RF-SiP technology and electronic device

Abstract

The invention relates to the technical field of radio frequency electronics, in particular to a surface acoustic wave switch filtering module based on an RF-SiP technology and an electronic device. The surface acoustic wave switch filtering module comprises a ceramic surface mount tube base, a metal cover plate and bare chips of electronic components, and the bare chips of the electronic components comprise a surface acoustic wave filter chip, a radio frequency switch chip and a capacitor chip. A bare chip of the electronic component is positioned in the step cavity of the ceramic surface-mounted tube socket and the sunken cavity of the step cavity. The metal cover plate is welded at the top of the ceramic surface-mounted tube socket so as to package a bare chip of the electronic component. The switch filtering function integration module formed by integrating the surface acoustic wave filter chip, the radio frequency switch chip and the capacitor chip by adopting a radio frequency system-in-package RF-SiP technology can greatly reduce the structural size and improve radio frequency performance deterioration caused by an interconnection structure, thereby meeting the requirements of a miniaturized receiver.

Description

technical field [0001] The invention relates to the technical field of radio frequency electronics, in particular to a surface acoustic wave switch filter module and electronic equipment based on RF-SiP technology. Background technique [0002] At present, the existing surface acoustic wave switch filter amplification modules all use packaged surface acoustic wave filters and other packaged components. Since each component is individually packaged and then interconnected, the module volume is relatively large; and as the frequency increases (especially Above 1GHz), the size reduction of the module will also be at the expense of performance. In addition, the degradation of radio frequency performance caused by traditional surface acoustic wave filter packaging and interconnection structures, as well as the large package size, increase the difficulty of miniaturization of receivers, and push up the development and production costs of miniaturized receivers. Contents of the i...

AI Technical Summary

Problems solved by technology

[0002] At present, the existing surface acoustic wave switch filter amplification modules all use packaged surface acoustic wave filters and other packaged components. Since each component is individually packaged and then interconnected, the module volume is relatively large; and as the frequency increases (especially 1GHz or more), module size reduction will also be at the expense of performance

In addition, the degradation of radio frequency performance caused by traditional surface acoustic wave filter packaging and interconnection structures, as well as the large package size, increase the difficulty of miniaturization of receivers, and push up the development and production costs of miniaturized receivers

Images