Manufacturing method of second-order copper block embedded circuit board
A manufacturing method and a technology of embedding copper blocks, which are applied in the fields of multilayer circuit manufacturing, printed circuit manufacturing, and improvement of metal adhesion of insulating substrates, can solve problems such as low production efficiency and poor production quality, and reduce circumferential offset The probability of the connection is firm and the effect of increasing the contact area
Inactive Publication Date: 2020-08-21
广德牧泰莱电路技术有限公司
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Problems solved by technology
[0004] Based on this, it is necessary to address the problems of low production efficiency and poor production quality of traditional second-order buried copper circuit boards, and provide a processing method for second-order buried copper circuit boards that can improve production efficiency and product quality
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[0033] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. Preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided to make the understanding of the disclosure of the present invention more thorough and comprehensive.
[0034] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terms used herein in the description of the present invention are for the purpose of describing specific embodiments only, and are not intended to limit the present invention. As used herein, the term "and / or" includes any and all combinations of one or more of ...
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The invention relates to a manufacturing method of a second-order buried copper block circuit board. The manufacturing method of the second-order buried copper block circuit board comprises the following steps: stacking a plurality of substrates, and laminating the substrates to form an intermediate laminated plate; forming a first blind hole in the surface of the intermediate laminated plate, andperforming electroplating hole filling on the first blind hole to form a first conductive column; forming a T-shaped hole in the surface of the intermediate laminated plate; providing a T-shaped copper block with convex edges arranged on the side walls, clamping the T-shaped copper block into the T-shaped hole, solidifying a gap between the side wall of the T-shaped copper block and the inner wall of the T-shaped hole to form a gummosis layer, and respectively pressing copper foils on the two opposite surfaces of the intermediate laminated plate; and forming a second blind hole in the outer surface of the copper foil, performing electroplating hole filling on the second blind hole to form a second conductive column, and forming a leading-out circuit electrically connected with the secondconductive column on the outer surface of the copper foil. According to the processing method of the second-order copper block embedded circuit board, the production efficiency of the second-order copper block embedded circuit board is improved while the product quality is improved.
Description
technical field [0001] The invention relates to the technical field of manufacturing printed circuit boards, in particular to a method for manufacturing a second-order buried copper block circuit board. Background technique [0002] With the continuous improvement of people's requirements on the heat dissipation performance of printed circuit boards, the dense heat dissipation holes of traditional printed circuit boards can no longer meet the requirements of high heat dissipation. In order to solve the above problems, copper blocks are generally embedded in the printed circuit board. For the second-order buried copper block circuit board, the copper block and the multi-layer core board are firstly pressed together, and then the circuit is made for the second time, followed by drilling and electroplating to fill the holes, and finally three times of pressing and drilling and drilling. Electroplating and filling holes. [0003] However, since this method needs to be presse...
Claims
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Login to View More IPC IPC(8): H05K3/38H05K3/46
CPCH05K3/386H05K3/46H05K3/4614
Inventor 刘立张振新黄孟良
Owner 广德牧泰莱电路技术有限公司