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Dicing knife trimming method for gallium arsenide wafer

A gallium arsenide, dicing technology, applied in other manufacturing equipment/tools, grinding machine parts, grinding/polishing equipment, etc., to reduce dressing time, reduce positive and back avalanches, and reduce poor use.

Inactive Publication Date: 2020-09-08
ZHENGZHOU RES INST FOR ABRASIVES & GRINDING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] CN201811588982-The trimming method of the cutting tool, the blade trimming method mentioned in, the purpose is to remove the tip fillet of the electroplated thick knife, and reduce the loss of the sharpening plate, not to improve the cutting quality of the gallium arsenide blade, and the method It is completely unsuitable for ultra-thin fine-grained dicing knives for gallium arsenide cutting

Method used

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  • Dicing knife trimming method for gallium arsenide wafer
  • Dicing knife trimming method for gallium arsenide wafer
  • Dicing knife trimming method for gallium arsenide wafer

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Embodiment Construction

[0020] The implementation of the present invention will be illustrated by specific specific examples below, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification.

[0021] A method for repairing a gallium arsenide wafer with a dicing knife 1 proposed by the present invention, first uses a sharpening plate 2 to round the outer circle of the knife edge 1a, and then uses a gallium arsenide dummy 3 to sharpen the knife tip, so that the knife edge 1a The abrasive exposure of the tip is more suitable for cutting GaAs wafers. The second purpose is to test the performance of the blade for cutting GaAs. Ensure that the dicing knife 1 has a good initial cutting quality, and after adding 100% cutting performance inspection, the on-site cutting quality is more stable

[0022] The specific steps are: step 1, such as figure 1 As shown, the sharpening plate 2 is fixed on the suction cup 5 of...

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Abstract

The invention discloses a dicing knife trimming method for a gallium arsenide wafer. The method comprises the steps that S1, a sharpening plate is fixed, and a dicing knife is mounted; S2, knife sharpening is performed, as the number of sharpening the knife increases, the depth of cutting into the sharpening plate is gradually increased, the feeding speed is gradually increased, and a total of 20-40 cuts is carried out; S3, a gallium arsenide dummy is fixed; S4, sharpening is carried out, the depth of cutting into the gallium arsenide dummy gradually increases along with the increase of the number of sharpening the knife, the feeding speed is gradually increased, and a total of 20-50 cuts is carried out; and S5, cutting quality test is carried out, the seam width and the positive disintegration size are measured, if both the seam width and the positive disintegration size meet the requirements, trimming is completed; and if the seam width or the positive disintegration size exceeds thequality requirements, rework or scrapping is carried out. It is ensured that the dicing knife has good initial cutting quality, and after the 100% cutting performance test is added, the cutting quality is more stable on a customer site.

Description

technical field [0001] The invention belongs to the technical field of wafer cutting equipment, and in particular relates to a method for repairing a dicing knife for a gallium arsenide wafer. Background technique [0002] Gallium arsenide is the most mature compound semiconductor, and LED light-emitting chips based on gallium arsenide substrates are in great demand in the market. The demand for gallium arsenide wafers in 2017 was 1.7 million pieces, and the demand is increasing year by year. Scribing of gallium arsenide wafers currently only has a mature solution of dicing knives, so scribing knives currently have a large application market, and the growth momentum is strong. [0003] The scribing knife currently on the market usually exposes the abrasive material of the scribing knife through an electrolysis process, such as the mode of CN108411355A. Although sufficient exposure of the abrasive on both sides of the blade is ensured, direct cuts with electrolyzed blades u...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B1/00B24B3/36B24B41/06B24B47/12B24B47/20
CPCB24B1/00B24B3/36B24B41/06B24B47/12B24B47/20
Inventor 闫贺亮张迪邵俊永王战乔帅董峰李媛媛栗云慧
Owner ZHENGZHOU RES INST FOR ABRASIVES & GRINDING CO LTD
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