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Analysis method of embedded electroplating leveling agent into IC support plate through hole

An analysis method and leveling agent technology, which is applied in the field of analysis of through-hole filling electroplating leveling agents on IC substrates, can solve the problems of difficult cleaning of analysis electrodes, shortened service life of electrodes, unstable analysis results, etc., and achieve simple verification Clear, prolong service life, beneficial to the effect of control

Active Publication Date: 2020-09-11
COOKSON ENTHONE CHEM SHANGHAI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The disadvantage of this method is that the concentration of the additive is too high, which makes the analysis electrode difficult to clean, thus contaminating the analysis liquid and affecting the analysis results, the analysis results are unstable, the reproducibility is poor, and the service life of the electrode is shortened.

Method used

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  • Analysis method of embedded electroplating leveling agent into IC support plate through hole
  • Analysis method of embedded electroplating leveling agent into IC support plate through hole
  • Analysis method of embedded electroplating leveling agent into IC support plate through hole

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] Instruments and Conditions:

[0041] CVS instrument: Metrohm automatic 894CVS analyzer;

[0042] Working electrode: platinum electrode;

[0043] Electrode speed: 2600 rpm;

[0044] electrolyte;

[0045] Working temperature: 23°C

[0046] Analytical positive voltage: 1.625V;

[0047] Analyzing negative voltage: 0.175V;

[0048] Analysis steps:

[0049] The first electrode activation: Before the instrument analysis, place a blank VMS solution under the electrode and perform 15 electrode activations to ensure that the potential difference of the electrodes after two consecutive activations is less than 0.2%.

[0050] Make a standard curve: place 20ml of electrolyte solution under the electrode of the analyzer, place 5ml of standard solution into the autosampler of the analyzer, start the analyzer, and obtain the standard curve and correction factor.

[0051] Verify the correction factor: place the 20ml electrolyte under the electrode of the analyzer, place 5ml of th...

Embodiment 2

[0058] Instruments and Conditions:

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Abstract

The invention discloses an analysis method of embedded electroplating leveling agent into an IC support plate through hole. The analysis method comprises the following steps: preparing a standard solution; preparing an electrolyte; making a standard curve; verifying a correction factor: placing the electrolyte below an electrode of the analyzer, placing the standard solution into an automatic sample inlet of the analyzer, obtaining the concentration of a leveling agent of the standard solution through the analyzer, and comparing the concentration with the concentration of the leveling agent ofthe standard solution; and carrying out sample analysis: placing the electrolyte below an electrode of the analyzer, arranging a sample at an automatic sample inlet of the analyzer, starting the analyzer for analysis, and recording a potential diagram. The potential difference is obvious, and the analysis result is stable.

Description

technical field [0001] The invention relates to the field of analysis of leveling agents, in particular to an analysis method of electroplating leveling agents for filling through holes of IC carrier boards. Background technique [0002] MacDermid has developed a process of directly electroplating copper to fill the through-holes of the IC substrate, which solves the problems of hole bubbles in the traditional resin plug holes, the plug holes are not full, the resin and copper layers are easy to separate, and the thermal conductivity of the resin is not high. There are many problems such as increasing the number of devices and easily overloading. [0003] Among them, the main components of electroplating copper potion include: copper sulfate, sulfuric acid, chloride ion, brightener, wetting agent and leveling agent. [0004] The leveling agent affects the potential difference between the high and low positions. If the concentration of the leveling agent is too high, the per...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N27/00
CPCG01N27/00Y02P10/20
Inventor 曾琳丁惠萍
Owner COOKSON ENTHONE CHEM SHANGHAI
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