A liquid cooling radiator and communication equipment

Abstract

The present application provides a liquid-cooled radiator and a communication device. The liquid-cooled radiator includes a housing on which at least two heat dissipation areas arranged along a fluid flow direction are arranged. The heat dissipation requirements of the heat sources provided in each heat dissipation area are different, and fluid channels corresponding to each heat dissipation area are provided in the casing. In order to facilitate the flow of fluid and meet the different requirements for flow in different heat dissipation areas, the liquid cooling radiator provided in the present application is provided with a redistribution module between at least two adjacent fluid channels. The fluids of the fluid channels located upstream of the redistribution module are combined by the redistribution module, and the combined fluids are diverted to the fluid channels located downstream by the redistribution module. It can be seen from the above description that the fluid in the upstream fluid channel is merged through the redistribution module, and the entire stream of fluid after the confluence is redistributed to the downstream heat dissipation area, so that the areas with different heat dissipation requirements in the downstream heat dissipation area The corresponding traffic can be provided.

Description

technical field [0001] The present application relates to the technical field of heat dissipation, and in particular to a liquid-cooled radiator and communication equipment. Background technique [0002] At present, the power density of semiconductor devices is increasing, and there are not only many heating wafers, but also concentrated in the adjacent area. This requires liquid cooling radiators to have high heat dissipation efficiency, and can dissipate heat for different positions and different heat sources. Each heat source The temperature difference between them also needs to be maintained within a certain reasonable range. [0003] When existing liquid-cooled radiators dissipate heat for high-power semiconductor devices, the flow channels are not optimized for the differences in wafer distribution and heat loss. This will lead to a large temperature difference between the high heat flux wafer temperature inside the device and the low heat flux wafer, and may also cau...

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Problems solved by technology

However, when there are multiple heat sources for the liquid-cooled radiators designed by these two design methods, the design method of the flow channel is relatively complicated.

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