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Thinning process of optocoupler packaging lead frame material

A technology of lead frame and packaging lead, which is applied in the direction of stripping devices, manufacturing tools, metal processing equipment, etc., can solve the problems of product storage such as moisture absorption and oxidation, achieve significant production practical significance, avoid oxidation problems, and reduce the effect of exposed copper areas

Inactive Publication Date: 2020-09-18
FUJIAN TIANDIAN OPTOELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Ribs must be removed during the optocoupler packaging process, and the mesh construction lines will be removed by die cutting. After removal, the copper substrate will be exposed (without tin plating protection), which will easily cause subsequent product storage to absorb moisture and cause damage. Oxidation problems caused by

Method used

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  • Thinning process of optocoupler packaging lead frame material
  • Thinning process of optocoupler packaging lead frame material
  • Thinning process of optocoupler packaging lead frame material

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Embodiment Construction

[0021] The present invention will be further described below in conjunction with the accompanying drawings.

[0022] see Figure 1 to Figure 3 As shown, the present invention provides an embodiment: a thinning process of an optocoupler package lead frame material includes the following steps:

[0023] Step S1, install the stamping die into the hydraulic punching machine, and fix the upper and lower dies respectively;

[0024] Step S2, placing the uncut lead frame material 1 roll on the feed end of the punch press;

[0025] Step S3, fixing the lead frame element material head to the entrance of the stamping die;

[0026] Step S4, after the lead frame material 1 is fixed, the punch press performs the first mold clamping stamping;

[0027] Step S5, Punch the lead frame material 1 out of the positioning holes on both sides. After the positioning holes are punched out, the staff will open the mold. The lead frame material puts the positioning pin into the "upper side" of the fr...

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PUM

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Abstract

The invention provides a thinning process of an optocoupler packaging lead frame material. The thinning process comprises the following steps that S1, a stamping die is installed in an oil pressure punching machine, and an upper die and a lower die are fixed; S2, a unpunched lead frame material roll is placed at the feeding end of a punching machine; S3, the head of the lead frame material is fixed to an inlet of the stamping die; S4, after the lead frame material is fixed, the punching machine carries out first-time die assembly punching; S5, positioning holes in the two sides of the lead frame material is punched under the action of a punching knife of the punching machine; S6, after claw arms are moved out of the stamping die, stamping of the design shape of a functional area of the lead frame material is carried out; and S7, the punching knife of the punching machine continuously claps the area to be removed on the surface of the lead frame material to be thinned. According to thethinning process, thinning operation can be carried out on the optocoupler packaging lead frame material, and a copper exposure area for removing glue of the lead frame material can be effectively reduced.

Description

technical field [0001] The invention relates to the technical field of LED packaging, in particular to a process for thinning the lead frame material of an optocoupler package. Background technique [0002] At present, after the finished product is plastic-packed, the optocoupler must be tin-plated on the pins (the original pins are made of copper bottom material); after tinning, it is necessary to cut the ribs (remove the connecting ribs, such as mesh construction lines) before packaging the finished pins bend. [0003] Ribs must be removed during the optocoupler packaging process, and the mesh construction lines will be removed by die cutting. After removal, the copper substrate will be exposed (without tin plating protection), which will easily cause subsequent product storage to absorb moisture and cause damage. Oxidation problems caused. Contents of the invention [0004] In view of this, the object of the present invention is to provide a thinning process capable o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B21D28/02B21D28/04B21D45/06H01L33/62
CPCB21D28/02B21D28/04B21D45/06H01L33/62H01L2933/0066
Inventor 苏炤亘翁念义邱政康袁瑞鸿万喜红李昇哲杨皓宇
Owner FUJIAN TIANDIAN OPTOELECTRONICS CO LTD
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