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Through-substrate laser patterning and isolating of thin conductive films

A technology for substrates and conductive layers, applied in laser welding equipment, optics, shading screens, etc.

Pending Publication Date: 2020-09-22
CORNING INC +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there continues to be an unmet need for technologies that allow the controlled patterning of thin films to tune the conductivity and other electrical aspects of the film

Method used

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  • Through-substrate laser patterning and isolating of thin conductive films
  • Through-substrate laser patterning and isolating of thin conductive films
  • Through-substrate laser patterning and isolating of thin conductive films

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Embodiment Construction

[0019] The present disclosure can be understood more easily by referring to the following detailed description, drawings, examples, claims and the previous and following descriptions. However, before disclosing and describing the composition, product, device, and method of the present disclosure, it should be understood that the present disclosure is not limited to the specific composition, product, device, and method disclosed, unless otherwise specified, and therefore can of course be changed. It should also be understood that the terms used herein are only for the purpose of describing specific aspects and are not intended to be limiting.

[0020] The following description of the present disclosure is provided as a feasible teaching of the present disclosure with its currently known embodiments. For this reason, those skilled in the relevant art will recognize and understand that many changes can be made to various aspects of the disclosure described herein while still obtaini...

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Abstract

An invention disclosure discloses a composite structure. The composite structure includes a substrate layer (120), a conductive layer (140) and an over-layer (160). The substrate has a first face (124) and a second face (122). The conductive layer has a first face (148) and a second face (149). The first face of the conductive layer is disposed on the at least a part of the second face of the substrate layer. A portion (144) of the conductive layer has a resistivity at least about ten times higher than an adjacent region (146) on the conductive layer. The over-layer may have a first face (162)and a second face (166). The first face of the over-layer is disposed on at least a part of the second face of the conductive layer such that the conductive layer is disposed between the over-layer and the substrate layer. The substrate layer comprises a material that is optically transparent over at least a part of the electromagnetic spectrum from about 180 nm to about 20 [mu]m. The conductivelayer comprises a layer having a thickness of about 10 nm or greater and having a resistivity of about 10 Ohm-cm or less. The conductive layer comprises a material that may be optically translucent oropaque over at least a part of the electromagnetic spectrum from about 180 nm to about 20 [mu]m.

Description

Technical field [0001] This application claims the priority rights of U.S. Provisional Application Serial No. 62 / 618,291 filed on January 17, 2018 in accordance with the patent law, based on the content of the case and the content of the case is incorporated herein by reference in its entirety. [0002] The present disclosure generally relates to laser irradiation of thin films, and particularly relates to methods of using lasers to modify and isolate conductive layers. Background technique [0003] Many novel products are based on conductive, semi-conductive or isolation films. In most applications, the film thickness is in the nanometer to micrometer range, and the main function of the film is the optical and electrical nature. Useful process techniques for patterning these films require high processing speeds, small structure sizes, and applicability to large areas. The combination of high-speed printing methods and direct laser patterning provides high resolution at high thro...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02F1/155B23K26/57
CPCG02F1/155G02F1/1533C03C17/3417C03C2217/948C03C2218/154C03C2218/328E06B9/24E06B2009/2464B32B43/006B32B2310/0843
Inventor 詹姆斯·格雷戈里·科伊拉德明煌·黄李兴华
Owner CORNING INC