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Equipment and method thereof for vacuum sputtering deposition

A technology of vacuum sputtering and vacuum deposition is applied to equipment and fields for vacuum sputtering deposition, which can solve the problems of reducing manufacturing cost and increasing output.

Active Publication Date: 2020-09-29
APPLIED MATERIALS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, despite an increase in the number of thin-film transistors (TFTs) within a device, attempts are still being made to increase yield and reduce manufacturing costs

Method used

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  • Equipment and method thereof for vacuum sputtering deposition
  • Equipment and method thereof for vacuum sputtering deposition
  • Equipment and method thereof for vacuum sputtering deposition

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Embodiment Construction

[0018] Reference will now be made in detail to various embodiments of the present disclosure, one or more examples of which are illustrated in the drawings. In the following description of the drawings, the same reference numerals designate the same parts. In the following, only the differences with respect to individual embodiments are described. Each example is offered by way of explanation of the disclosure, and not meant as a limitation of the disclosure. Furthermore, features illustrated or described as part of one embodiment can be used on or in conjunction with other embodiments to yield a further embodiment. The description is intended to cover such modifications and variations.

[0019] In the present disclosure, the expression "processing gas atmosphere" is to be understood as the atmosphere in a processing chamber, in particular in a vacuum processing chamber of a device for depositing layers. A "processing gas atmosphere" may have a volume dictated by the space ...

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Abstract

The invention proposes equipment (100) for vacuum sputtering deposition. The equipment comprises a vacuum chamber (110); three or more sputtering negative electrodes in the vacuum chamber (110) for sputtering materials on a substrate (200); a gas distribution system (130) for providing a process gas including H2 to the vacuum chamber (110); a vacuum system (140) for providing vacuum in the vacuumchamber (110); and a safety layout (160) for reducing the risk of oxygen and hydrogen explosions, wherein the safety layout (160) comprises a dilution gas feed unit (165) connected to the vacuum system (140) for diluting the H2 content of the process gas (111).

Description

[0001] This application is a divisional application of an invention patent application with the application date of August 24, 2015, the application number is 201580082619.4, and the invention title is "equipment and method for vacuum sputtering deposition". technical field [0002] The present disclosure relates to apparatus and methods for coating substrates in vacuum process chambers. In particular, the present disclosure relates to apparatus and methods for forming at least one layer of sputtered material on a substrate for display fabrication. Background technique [0003] In many applications, thin layers need to be deposited on a substrate (eg, on a glass substrate). Conventionally, the substrates are coated in different chambers of the coating apparatus. For some applications, the substrate is coated in vacuum using vapor deposition techniques. Several methods are known for depositing materials on substrates. For example, the substrate may be coated by a physical ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/02C23C14/08C23C14/34C23C14/54H01J37/32H01J37/34
CPCC23C14/0063C23C14/3464H01J37/32449H01J37/32834H01J37/3405H01J37/3473Y02C20/30H01J37/32844H01J37/3494C23C14/0042C23C14/086C23C14/352H01J2237/0203H01J2237/182H01J2237/24585H01J2237/332H01L21/2855H01L27/1262
Inventor 丹尼尔·塞韦林托马斯·格比利托马斯·莱普尼茨
Owner APPLIED MATERIALS INC
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