PCB function testing device and system

Abstract

The invention discloses a PCB function testing device and system. The device comprises a clamp, a connecting plate and a PCB, a Pogo pin is arranged at the side, facing the connecting plate, of the clamp; the connecting plate is positioned between the PCB and the clamp; a first bonding pad is arranged at one side facing the clamp; the first bonding pad is in contact with the Pogo pin; a preset distance is formed between the connecting plate and the clamp; the preset distance is determined according to the minimum distance between the PCB and the clamp, an elastic piece is arranged on the side,facing the connecting plate, of the PCB, a second bonding pad is arranged on the side, facing the PCB, of the connecting plate, the elastic piece makes contact with the second bonding pad, the firstbonding pad is electrically connected with the second bonding pad, and the connecting plate tests the elastic piece on the PCB under the effect of the clamp. Therefore, the elastic sheet is preventedfrom being crushed while the connecting plate is in contact with the elastic sheet, the reject ratio and the rejection rate of the PCB function test are reduced, and the error of the PCB function testcaused by the damage of the elastic sheet is reduced.

Description

technical field [0001] The present invention relates to the mechanical field, in particular to a PCB (Printed Circuit Board, printed circuit board) function testing device and system. Background technique [0002] The PCB is the provider of the electrical connection of electronic components, therefore, the circuit connection in the PCB cannot be lost. In the prior art, the detection of the PCB is to press down the shrapnel on the PCB by the pogo pin (pogo pin) on the fixture, so that the pogo pin is connected to the shrapnel, and the function test of the PCB is carried out according to whether the pogo pin and the shrapnel are connected. . [0003] However, the defect of the prior art is that the pogo pin directly presses down on the shrapnel, so it is difficult to control the elastic force of the pogo pin, causing the shrapnel to be crushed due to the excessive elastic force of the pogo pin, such as figure 1 As shown, due to the excessive elastic force, the shrapnel is de...

AI Technical Summary

Problems solved by technology

[0003] However, the defect of the prior art is that the pogo pin directly presses down on the shrapnel, so it is difficult to control the elastic force of the pogo pin, causing the shrapnel to be crushed due to the excessive elastic force of the pogo pin, such as figure 1 As shown, due to the excessive elastic force, the shrapnel is deformed, which leads to errors in the detection results, which increases the PCB defect rate and scrap rate, and increases the cost.

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