A Steady State Thermal Analysis Method for Multilayer PCB Structure

Abstract

The invention discloses a method for steady-state thermal analysis of a multilayer PCB structure, comprising: S1, constructing a steady-state heat balance equation of the insulating layer of a PCB substrate, and obtaining a matrix expression of an analytical solution of the insulating layer of the substrate; S2, correcting boundary conditions of the insulating layer of the substrate , and the heat generation rate of the components is included in the matrix expression of the analytical solution as the known heat source condition; S3, the calculation is summarized to obtain the lumped matrix equation of the metal layer heat diffusion, and the heat conduction of the metal via is included in the heat diffusion matrix equation ; S4, constructing the thermal analysis coupled equations of the multilayer PCB structure; S5, calculating and summarizing to obtain the lumped matrix equation describing the linear relationship between the potentials of the metal layer units, and finding the potential distribution in the metal layer, and further finding the metal layer Current density distribution and Joule heating distribution, and the Joule heating distribution can be included in the thermal diffusion matrix equation of the metal layer, and iterative calculations can be carried out between the temperature distribution to obtain the temperature distribution on the surface of each layer of the PCB under the premise of including the Joule heating of the line .

Description

technical field [0001] The invention belongs to the technical field of PCB thermal analysis, and in particular relates to a steady-state thermal analysis method for a multilayer PCB structure. Background technique [0002] PCB is not only the carrier of electronic devices, but also the main medium for heat dissipation of components. PCB-level thermal analysis can realize the role of assisting in optimizing PCB design and analyzing the reliability of electronic systems], if combined with chip-level and package-level thermal analysis programs Co-simulation can achieve objective prediction of internal hot spots of integrated circuits while considering the actual PCB structure and circuit layout as well as thermal boundary conditions. By establishing the equivalent thermal analysis model of the PCB local circuit or the whole in the thermal analysis software, the heat conduction and heat dissipation design of the PCB circuit can be assisted. On the one hand, a more practical heat...

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Problems solved by technology

[0009] The purpose of the present invention is to address the above-mentioned deficiencies in the prior art and provide a steady-state thermal analysis method for multilayer PCB structures to solve the problem of large thermal analysis errors in existing PCB structures

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