Steady-state thermal analysis method for multilayer PCB structure

Abstract

The invention discloses a steady-state thermal analysis method for a multilayer PCB structure. The method comprises the steps of: S1, building a steady-state thermal balance equation of an insulatinglayer of a PCB substrate, and obtaining a matrix expression of an analytical solution of the insulating layer of the substrate; S2, correcting boundary conditions of the insulating layer of the substrate, and including the heating rate of the component as a known heat source condition in the matrix expression of the analytical solution; S3, calculating and concluding to obtain a metal layer thermal diffusion lumped matrix equation, and counting heat conduction of a metal via hole in the thermal diffusion matrix equation; S4, constructing a thermal analysis coupling equation set of the multilayer PCB structure; and S5, calculating and concluding to obtain a lumped matrix equation for describing the linear relationship between the potentials of the metal layer units, obtaining potential distribution in the metal layer, further obtaining current density distribution and joule heating distribution of the metal layer, counting the joule heating distribution into a metal layer thermal diffusion matrix equation, and carrying out iterative calculation with temperature distribution, so as to obtain temperature distribution of the surface where each layer of the PCB is located on the premiseof counting joule heating of a circuit.

Description

technical field [0001] The invention belongs to the technical field of PCB thermal analysis, and in particular relates to a steady-state thermal analysis method for a multilayer PCB structure. Background technique [0002] PCB is not only the carrier of electronic devices, but also the main medium for heat dissipation of components. PCB-level thermal analysis can realize the role of assisting in optimizing PCB design and analyzing the reliability of electronic systems], if combined with chip-level and package-level thermal analysis programs Co-simulation can achieve objective prediction of internal hot spots of integrated circuits while considering the actual PCB structure and circuit layout as well as thermal boundary conditions. By establishing the equivalent thermal analysis model of the PCB local circuit or the whole in the thermal analysis software, the heat conduction and heat dissipation design of the PCB circuit can be assisted. On the one hand, a more practical heat...

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Problems solved by technology

[0009] The purpose of the present invention is to address the above-mentioned deficiencies in the prior art and provide a steady-state thermal analysis method for multilayer PCB structures to solve the problem of large thermal analysis errors in existing PCB structures

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