A printed circuit board for computer and its manufacturing method

Abstract

The invention relates to the technical field of printed circuit boards, and discloses a printed circuit board for a computer. The printed circuit board comprises a substrate, an insulating layer fixedly connected to the substrate and a solder resist uniformly sprayed to the insulating layer, wherein a circuit pattern is further installed in the insulating layer, heat dissipation devices are installed on the two sides of the substrate and the two sides of the insulating layer respectively, a containing groove is formed in the insulating layer, and an inserting assembly is installed in the containing groove. According to the invention, the heat dissipation effect of the substrate can be improved through the heat dissipation devices, so that the printed circuit board can achieve the purpose of rapid heat dissipation in a short time; the printed circuit board is good in installation tightness and not prone to loosening and other problems; and the circuit pattern can be firmly installed inthe insulating layer through the inserting assembly, so that the situation that an overlarge gap exists between the circuit pattern and the insulating layer due to excessive etching is avoided so as to guarantee that the circuit pattern is not prone to falling off from the interior of the insulating layer.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a computer printed circuit board and a manufacturing method thereof. Background technique [0002] Printed circuit boards {Printed circuit boards}, also known as printed circuit boards, are providers of electrical connections for electronic components. Printed circuit boards are often represented by "PCB" instead of "PCB boards". The number of layers can be divided into single-sided boards, double-sided boards, four-layer boards, six-layer boards and other multi-layer circuit boards. [0003] However, in the actual production process of the existing printed circuit board, due to the excessive etching of the circuit pattern, it is easy to cause an excessive gap between the exposed circuit pattern and the insulating layer, which will cause the circuit pattern to fall off. The circuit board also lacks a corresponding heat dissipation structure, and it is difficult to...

AI Technical Summary

Problems solved by technology

[0003] However, in the actual production process of the existing printed circuit board, due to the excessive etching of the circuit pattern, it is easy to cause an excessive gap between the exposed circuit pattern and the insulating layer, which will cause the circuit pattern to fall off. The circuit board also lacks a corresponding heat dissipation structure, and it is difficult to complete the heat dissipation needs in a short time.

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