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Packaging structure manufacturing method and packaging structure

A packaging structure and manufacturing method technology, which is applied in semiconductor/solid-state device manufacturing, semiconductor/solid-state device parts, semiconductor devices, etc., can solve the problem of chip and circuit burnout, large grounding resistance, and packaging products that cannot be used normally, etc. problem, to achieve the effect of preventing burnout, reducing grounding resistance, and satisfying electrical conductivity

Active Publication Date: 2020-10-09
FOREHOPE ELECTRONICS NINGBO CO LTD
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  • Abstract
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  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In the prior art plastic ball grid array packaging (Plastic Ball Grid Array Package, referred to as PBGA) manufacturing method, it is necessary to draw solder paste or conductive colloid on the substrate to realize the conductivity of the heat dissipation cover. Due to the solder paste or conductive colloid, The material itself has a certain dielectric loss, which leads to a large grounding resistance of PBGA products, which can easily cause the internal product chips and lines to burn out, and then cause the packaged products to be unable to use normally.

Method used

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  • Packaging structure manufacturing method and packaging structure
  • Packaging structure manufacturing method and packaging structure
  • Packaging structure manufacturing method and packaging structure

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Embodiment Construction

[0043] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. The components of the embodiments of the invention generally described and illustrated in the figures herein may be arranged and designed in a variety of different configurations.

[0044] Accordingly, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art wi...

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Abstract

The embodiment of the invention provides a packaging structure manufacturing method and a packaging structure, and relates to the technical field of packaging. The manufacturing method of the packaging structure comprises the following steps: providing a chip and a heat dissipation cover, wherein the chip is provided with a circuit bonding pad, and the heat dissipation cover is provided with a grounding end and a mounting groove; arranging the chip in the mounting groove; plastically packaging the chip and the heat dissipation cover, and exposing the circuit bonding pad and the grounding end;leading out an RDL circuit from the circuit bonding pad and the grounding end; and filling the RDL circuit with a dielectric layer, and forming a grounding bonding pad and a ball mounting bonding padon the dielectric layer, wherein the grounding bonding pad is connected with the grounding end, and the ball mounting bonding pad is connected with the circuit bonding pad. Because the RDL line is directly led out from the grounding end and the line bonding pad, that is, the heat dissipation cover is directly connected with the RDL line, the reduction of grounding resistance is facilitated, and the service life of the packaging structure is prolonged.

Description

technical field [0001] The present invention relates to the field of packaging technology, in particular, to a method for manufacturing a packaging structure and a packaging structure. Background technique [0002] In the prior art plastic ball grid array packaging (Plastic Ball Grid Array Package, referred to as PBGA) manufacturing method, it is necessary to draw solder paste or conductive colloid on the substrate to realize the conductivity of the heat dissipation cover. Due to the solder paste or conductive colloid, The material itself has a certain dielectric loss, which leads to a large grounding resistance of PBGA products, which can easily cause the internal product chips and lines to burn out, and then cause the packaged products to be unable to use normally. Contents of the invention [0003] The purpose of the present invention includes, for example, to provide a packaging structure manufacturing method and packaging structure, which can meet the conductivity of ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/60H01L23/367H01L23/485H01L23/60
CPCH01L23/3675H01L23/60H01L23/4824H01L24/03H01L2224/0231H01L2224/02331H01L2224/02381H01L2224/02379H01L2224/18H01L2224/96H01L2924/3511H01L2224/32245H01L2224/73267H01L2224/92244H01L2924/15156
Inventor 张吉钦何正鸿
Owner FOREHOPE ELECTRONICS NINGBO CO LTD
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