Packaging structure manufacturing method and packaging structure

Abstract

Embodiments of the present invention provide a method for manufacturing a package structure and a package structure, which relate to the technical field of packaging. The manufacturing method of the package structure includes providing a chip and a heat dissipation cover; wherein, the chip is provided with a circuit pad, and the heat dissipation cover is provided with a ground terminal and a mounting groove. Set the chip in the mounting groove; plastic-encapsulate the chip and the heat dissipation cover, and expose the circuit pad and the ground terminal; lead the RDL circuit from the circuit pad and the ground terminal; fill the RDL circuit with a dielectric layer, and form on the dielectric layer A ground pad and a ball-mounting pad; wherein, the ground pad is connected to the ground terminal, and the ball-mounting pad is connected to the circuit pad. Since the RDL line is directly drawn from the ground terminal and the line pad, that is, the heat dissipation cover is directly connected to the RDL line, it is beneficial to reduce the grounding resistance and prolong the service life of the package structure.

Description

technical field [0001] The present invention relates to the technical field of packaging, and in particular, to a method for manufacturing a packaging structure and a packaging structure. Background technique [0002] In the prior art plastic Ball Grid Array Package (Plastic Ball Grid Array Package, PBGA for short) process manufacturing method, it is necessary to use solder paste or conductive colloid on the substrate to achieve the electrical conductivity of the heat dissipation cover. The material itself has a certain dielectric loss, which leads to a large grounding resistance value of PBGA products, which easily causes the internal product chips and lines to burn out, which in turn makes the packaged products unable to use normally. SUMMARY OF THE INVENTION [0003] The objects of the present invention include, for example, providing a method for manufacturing a package structure and a package structure, which can satisfy the electrical conductivity of the heat dissipa...

AI Technical Summary

Problems solved by technology

[0002] In the prior art plastic ball grid array packaging (Plastic Ball Grid Array Package, referred to as PBGA) manufacturing method, it is necessary to draw solder paste or conductive colloid on the substrate to realize the conductivity of the heat dissipation cover. Due to the solder paste or conductive colloid, The material itself has a certain dielectric loss, which leads to a large grounding resistance of PBGA products, which can easily cause the internal product chips and lines to burn out, and then cause the packaged products to be unable to use normally.

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