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41results about How to "Meet conductivity" patented technology

Low-diameter high-strength polyacrylonitrile-based carbon fibers and preparation method thereof

The invention relates to low-diameter high-strength polyacrylonitrile-based carbon fibers and a preparation method thereof. According to the method, acrylonitrile containing itaconic acid and methyl methacrylate is used as a ternary polymerization system, and an organic diol crosslinking agent is added in a polymerization process for polymerizing, so that a spinning stock solution which has a polymer content of 12.5-17.5% and a viscosity of 120-800 CP is obtained; due to the addition of the crosslinking agent, the spinnability and high drafting of the spinning solution with low polymer contentand low viscosity are improved; then, a wet spinning process is adopted and matched with reasonable solidification conditions and a spinning drafting process, so that low-diameter polyacrylonitrile precursor with surface grooves is prepared; the precursor is pre-oxidized, and is carbonized at a low temperature and a high temperature, so as to obtain the monofilament which has the equivalent diameter of 2-3 mum, the tensile strength of more than or equal to 3.5 GPa, and the tensile modulus of more than or equal to 230 Gpa; therefore, the low-diameter and high-strength polyacrylonitrile-based carbon fibers with a regular surface groove structure are obtained. The carbon fiber obtained by method can improve the flexibility of carbon fiber paper for fuel cells.
Owner:BEIJING UNIV OF CHEM TECH

Preparation method of rare earth modified spinel coating

The invention belongs to the field of metal surface modification, and particularly relates to a preparation method of a rare earth modified spinel coating. The preparation method specifically comprises the following steps: uniformly mixing cobalt powder, manganese dioxide powder and lanthanum oxide powder in proportion; preparing an electrode material by adopting a hot-pressing sintering method; then, depositing the electrode material on the surface of stainless steel by adopting a high-energy micro-arc alloying method under inert gas shielding to prepare a cobalt-based compound oxide coating which has good conductivity; and further placing the coating in an air or oxygen environment to heat and preoxidize to prepare a cobalt manganese spinel and lanthanum cobaltate compounded oxide coating. The cobalt manganese spinel and lanthanum cobaltate compounded oxide coating prepared by the process has good high temperature antioxidant and conductive performances, overcomes the problem that the prior spinel coating and metal interfaces are insecure to bind, and the coating is low in compactness and different in coefficient of thermal expansion and the like, and can satisfy the demands of anti-oxidation, conductivity, anti-Cr volatilization and the like on a ferritic stainless steel connector.
Owner:南通东湖国际商务服务有限公司

Ultra-thin metal grid-based transparent electrode and preparation method thereof

The invention discloses an ultra-thin metal grid-based transparent electrode and a preparation method thereof, and relates to the technical field of a transparent electrode. The ultra-thin metal grid-based transparent electrode comprises a surface modified flexible transparent substrate; and a conductive metal grid layer with thickness of 1-10nm is deposited on the modified surface of the flexibletransparent substrate. The preparation method of the transparent electrode comprises the steps of grafting a layer of amino group on the surface of the substrate, forming a mask plate by photoresistor adhesive printing, depositing a metal layer with thickness of 1-10nm in the gap of the mask plate, and removing the mask plate to obtain the ultra-thin metal grid-based transparent electrode. By lowering the thickness of the metal grids, the light transmittance of the metal grids is improved; and meanwhile, the metal grids still have relatively high conductivity at the thickness of 1-10nm, so that the problem of "waxing and waning" between the conductivity and the light transmittance of the transparent electrode can be solved, and balance of the conductivity and the light transmittance is realized.
Owner:NINGBO INST OF MATERIALS TECH & ENG CHINESE ACADEMY OF SCI +1

Manufacturing technology of bipolar plate

The invention discloses a manufacturing technology of a bipolar plate. The manufacturing technology comprises the following steps: (1) selecting and using enough polyethylene paraffin, putting the polyethylene paraffin into a container, and heating until the polyethylene paraffin is completely fused; (2) immersing a graphite plate into the fused polyethylene paraffin, and taking out the immersed graphite plate until no bubble is emitted; and (3) hemming the graphite plate through paraffin immersing treatment to guarantee no weeping inside, and then connecting the hemmed graphite plate with theshell of a battery through PVC glue, wherein two sides of the graphite plate through paraffin immersing treatment are both connected with graphite felts as a positive electrode and a negative electrode of the battery; and (4) then after sealing, forming serially connected connecting points of the positive electrodes and the negative electrodes of two batteries on the graphite plate, namely the bipolar plate. According to the manufacturing technology, the polyethylene paraffin material is selected and used as a filler of the graphite plate, on one hand, the permeation problem of the graphite plate is solved, and on the other hand, the electrical conductivity of the graphite plate in a zinc-iodine battery is met; the bipolar plate with small volume and good electrical conductivity is formed; and the problem of filler fusion caused by the fat that the zinc-iodine battery is heated in the using process is also solved.
Owner:EAST CHINA NORMAL UNIV

Span adjustable grounding wire head clamp device

The invention relates to the technical field of a span adjustable grounding wire head clamp device. The device is characterized in that an upper retaining ring, a concave pillar and a lower retaining ring and a wire hanging plate thereof are connected by screws; and an adjustable retaining hole and a ground wire hanging groove are also arranged at the bottom of the lower retaining ring and the wire hanging plate thereof. The device has the following beneficial effects that the problem of installation of grounding wires of overhead single conductors with current-carrying capacities being above 879A and wire diameter areas being above 400mm<2> and overhead composite conductors with current-carrying capacities being above 1620A and wire diameter areas being above 400mm<2>*2 and the problem that the grounding wires are difficult to install in the places needing installation of the grounding wires due to various reasons are solved; and the device meets the requirements of electrical conductivity and heat resistance, has simple structure and can not only appropriately adjust the span to meet the installation requirement according to the overhead wire diameters on the site but also be suitable for various grounding wire conductor terminal joints.
Owner:SHENYANG POWER SUPPLY LIAONING POWER +1

Packaging structure manufacturing method and packaging structure

The embodiment of the invention provides a packaging structure manufacturing method and a packaging structure, and relates to the technical field of packaging. The manufacturing method of the packaging structure comprises the following steps: providing a chip and a heat dissipation cover, wherein the chip is provided with a circuit bonding pad, and the heat dissipation cover is provided with a grounding end and a mounting groove; arranging the chip in the mounting groove; plastically packaging the chip and the heat dissipation cover, and exposing the circuit bonding pad and the grounding end;leading out an RDL circuit from the circuit bonding pad and the grounding end; and filling the RDL circuit with a dielectric layer, and forming a grounding bonding pad and a ball mounting bonding padon the dielectric layer, wherein the grounding bonding pad is connected with the grounding end, and the ball mounting bonding pad is connected with the circuit bonding pad. Because the RDL line is directly led out from the grounding end and the line bonding pad, that is, the heat dissipation cover is directly connected with the RDL line, the reduction of grounding resistance is facilitated, and the service life of the packaging structure is prolonged.
Owner:FOREHOPE ELECTRONICS NINGBO CO LTD

Vehicle body end wall synthesis tool and process

The invention discloses a vehicle body end wall synthesis tool and a process. The vehicle body end wall synthesis tool comprises a tool platform, a supporting copper table and a pressing assembly, and an auxiliary electrode is arranged on the tool platform; the supporting copper table is arranged on the tool platform, used for loading an end wall auxiliary plate and an end wall assembly, and can form continuous surface support for a to-be-welded part between the end wall auxiliary plate and the end wall assembly; the supporting copper table is electrically connected with the auxiliary electrode; and the pressing assembly is arranged on the tool platform and used for pressing the end wall auxiliary plate and the end wall assembly on the tool platform. The tool is reasonable in structural design, and through the arrangement of the supporting copper table, the problems that in the prior art, due to the fact that part of end wall auxiliary plate faces are not supported, the flatness is poor, welding point indentations are deep due to the welding mode, the welding difficulty between the end wall assembly and the end wall auxiliary plate is increased, and the welding quality is reduced are solved; and in addition, the invention further provides the vehicle body end wall synthesis process based on the vehicle body end wall synthesis tool, operation steps are simple, and practicability is high.

A kind of transparent electrode based on ultra-thin metal grid and preparation method thereof

The invention discloses an ultra-thin metal grid-based transparent electrode and a preparation method thereof, and relates to the technical field of a transparent electrode. The ultra-thin metal grid-based transparent electrode comprises a surface modified flexible transparent substrate; and a conductive metal grid layer with thickness of 1-10nm is deposited on the modified surface of the flexibletransparent substrate. The preparation method of the transparent electrode comprises the steps of grafting a layer of amino group on the surface of the substrate, forming a mask plate by photoresistor adhesive printing, depositing a metal layer with thickness of 1-10nm in the gap of the mask plate, and removing the mask plate to obtain the ultra-thin metal grid-based transparent electrode. By lowering the thickness of the metal grids, the light transmittance of the metal grids is improved; and meanwhile, the metal grids still have relatively high conductivity at the thickness of 1-10nm, so that the problem of "waxing and waning" between the conductivity and the light transmittance of the transparent electrode can be solved, and balance of the conductivity and the light transmittance is realized.
Owner:NINGBO INST OF MATERIALS TECH & ENG CHINESE ACADEMY OF SCI +1

Organic self-supporting single crystal film and preparation method and application thereof

The invention discloses an organic self-supporting single crystal film and a preparation method and application thereof. The organic self-supporting single crystal film is composed of large two-dimensional flaky organic semiconductor single crystals. The preparation method comprises the steps that a sandwich structure formed by an organic semiconductor solution and two ion liquids is provided, wherein the first ion liquid does not mix with the organic semiconductor solution, the second ion liquid slightly mixes with the organic semiconductor solution, the density of the first ion liquid is higher than that of the organic semiconductor solution, and the density of the second ion liquid is lower than that of the organic semiconductor solution; and a solvent in the organic semiconductor solution is slowly dissolved with the second ion liquid and penetrates through the second ion liquid to volatize, so that the organic semiconductor material is slowly self-assembled between the two ion liquids to form the organic self-supporting single crystal film. The organic self-supporting single crystal film has the advantages of solubilized preparation, large-size two-dimensional single crystals,high flexibility and the like, and the preparation method is easy to operate.
Owner:SUZHOU INST OF NANO TECH & NANO BIONICS CHINESE ACEDEMY OF SCI

A kind of low-diameter high-strength polyacrylonitrile-based carbon fiber and preparation method thereof

The invention relates to low-diameter high-strength polyacrylonitrile-based carbon fibers and a preparation method thereof. According to the method, acrylonitrile containing itaconic acid and methyl methacrylate is used as a ternary polymerization system, and an organic diol crosslinking agent is added in a polymerization process for polymerizing, so that a spinning stock solution which has a polymer content of 12.5-17.5% and a viscosity of 120-800 CP is obtained; due to the addition of the crosslinking agent, the spinnability and high drafting of the spinning solution with low polymer contentand low viscosity are improved; then, a wet spinning process is adopted and matched with reasonable solidification conditions and a spinning drafting process, so that low-diameter polyacrylonitrile precursor with surface grooves is prepared; the precursor is pre-oxidized, and is carbonized at a low temperature and a high temperature, so as to obtain the monofilament which has the equivalent diameter of 2-3 mum, the tensile strength of more than or equal to 3.5 GPa, and the tensile modulus of more than or equal to 230 Gpa; therefore, the low-diameter and high-strength polyacrylonitrile-based carbon fibers with a regular surface groove structure are obtained. The carbon fiber obtained by method can improve the flexibility of carbon fiber paper for fuel cells.
Owner:BEIJING UNIV OF CHEM TECH
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