Three-dimensional circuit manufacturing method and modified laser sintering powder materials

Abstract

The invention discloses a three-dimensional circuit manufacturing method. The method comprises the steps that a prototype model is generated through a selective laser sintering method, wherein modified laser sintering powder materials comprising components suitable for laser surface activation are used as the raw materials for the prototype model; preset selective scanning is carried out on the surface of the prototype model through laser, so that a surface activation area is formed; a conductive circuit is formed in the surface activation area through chemical plating. The invention further discloses the modified laser sintering powder materials used for the three-dimensional circuit manufacturing method. According to the three-dimensional circuit manufacturing method and the modified laser sintering powder materials, the limitation brought by traditional SLS processing materials on the application is overcome, meanwhile, a matrix with the complex surface is formed, and the requirements for rapid manufacturing and forming of the conductive circuit and laser activation are effectively met.

Description

technical field [0001] The invention relates to the field of circuit production, in particular to a method for producing a three-dimensional circuit and a modified laser sintering powder material. Background technique [0002] For the manufacturing process of electronic appliances and electromechanical products and the corresponding material technology, the pursuit direction is flexibility, environmental protection, speed and energy saving. The industry has developed a technology called 3D-MID (Three-dimensional molded interconnect device or electronic assemblies), which forms precise and compact conductive patterns on the surface of plastic, and electronic components can be directly welded on the plastic shell or inner shell to form Electronic appliances and mechatronics products without printed circuit boards. This technology is applied to the production of three-dimensional circuits, which saves circuit space for electronic and electrical products and electromechanical p...

AI Technical Summary

Problems solved by technology

[0007] However, traditional SLS parts cannot meet the requirements of laser surface activation, and there is no laser equipment that can effectively integrate SLS technology, so it is impossible to manufacture products with circuits inside plastic parts through traditional SLS technology

Images