Three-dimensional circuit manufacturing method and modified laser sintering powder materials

A production method, laser sintering technology, applied in the direction of printed circuit manufacturing, printed circuit, electrical components, etc., can solve the problems that cannot meet the requirements of laser surface activation, integrate SLS technology, and cannot manufacture plastic parts, etc., to meet laser activation and Conductive circuit forming requirements, not limited by shape, and the effect of eliminating defects

Active Publication Date: 2014-12-24
SHENZHEN SUNSHINE LASER & ELECTRONICS TECH CO LTD
View PDF6 Cites 9 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, traditional SLS parts cannot meet the requirements of laser surface activation, and there is no laser equipment that can effectively integrate SLS technology, so it is impossible to manufacture products with circuits inside plastic parts through traditional SLS technology

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Three-dimensional circuit manufacturing method and modified laser sintering powder materials

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0028] Embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings. It should be emphasized that the following description is only exemplary and not intended to limit the scope of the invention and its application.

[0029] In some embodiments, a method for manufacturing a three-dimensional circuit is as figure 1 shown, including the following steps.

[0030] step one , Generating prototypes by selective laser sintering (SLS) method.

[0031] The modified SLS powder raw material suitable for laser surface activation is used. The plastic base material can be polyamide (ie nylon). Specifically, nylon base materials commonly used in the market such as PA66 and PA12 can be used. Metal complexes are added to the above base materials. compound, and the metal complex compound is coated with silica. In a preferred embodiment, the total amount of modified SLS powder raw materials is calculated as 100 parts by mass, the plast...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
diameteraaaaaaaaaa
diameteraaaaaaaaaa
diameteraaaaaaaaaa
Login to view more

Abstract

The invention discloses a three-dimensional circuit manufacturing method. The method comprises the steps that a prototype model is generated through a selective laser sintering method, wherein modified laser sintering powder materials comprising components suitable for laser surface activation are used as the raw materials for the prototype model; preset selective scanning is carried out on the surface of the prototype model through laser, so that a surface activation area is formed; a conductive circuit is formed in the surface activation area through chemical plating. The invention further discloses the modified laser sintering powder materials used for the three-dimensional circuit manufacturing method. According to the three-dimensional circuit manufacturing method and the modified laser sintering powder materials, the limitation brought by traditional SLS processing materials on the application is overcome, meanwhile, a matrix with the complex surface is formed, and the requirements for rapid manufacturing and forming of the conductive circuit and laser activation are effectively met.

Description

technical field [0001] The invention relates to the field of circuit production, in particular to a method for producing a three-dimensional circuit and a modified laser sintering powder material. Background technique [0002] For the manufacturing process of electronic appliances and electromechanical products and the corresponding material technology, the pursuit direction is flexibility, environmental protection, speed and energy saving. The industry has developed a technology called 3D-MID (Three-dimensional molded interconnect device or electronic assemblies), which forms precise and compact conductive patterns on the surface of plastic, and electronic components can be directly welded on the plastic shell or inner shell to form Electronic appliances and mechatronics products without printed circuit boards. This technology is applied to the production of three-dimensional circuits, which saves circuit space for electronic and electrical products and electromechanical p...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K3/10C08L77/00C08K9/10
Inventor 蔡志祥王浩杨伟南威邹凯
Owner SHENZHEN SUNSHINE LASER & ELECTRONICS TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap