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A bonded gold ribbon and its preparation method

An alloy ribbon and gold ribbon technology, applied in circuits, electrical solid devices, semiconductor devices, etc., can solve the problems of inability to meet bonding requirements, low strength, poor solderability, etc., and achieve improved mechanical properties, high current resistance, and connection. solid effect

Active Publication Date: 2021-12-17
上杭县紫金佳博电子新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the gold ribbon processed only by pure gold is very soft, has low strength, poor solderability, and cannot meet the bonding requirements.

Method used

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  • A bonded gold ribbon and its preparation method
  • A bonded gold ribbon and its preparation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] A bonding gold ribbon, its composition and content (percentage by weight) are as follows: Au 99.9984%, Be 0.0003%, Cu 0.0003%, Fe 0.0003%, Mg 0.0003%, Ag 0.0003% and other impurities 0.001%.

[0027] The preparation method of the bonding gold ribbon is as follows, the target size is: 0.125mm (width) × 0.0125mm (thickness):

[0028] (1) Put gold into the continuous casting furnace, then add trace elements Be, Cu, Fe, Mg and Ag, melt at 1200°C (1150-1250°C is acceptable), and cast gold rods.

[0029] (2) Use a wire drawing machine to draw the gold rod and process it into a gold wire of φ0.0453mm. The diameter tolerance of the gold wire is controlled to be ±0.0003mm; the elongation rate of the mold during the wire drawing process is 8% to 15%, and the wire drawing speed is 7 to 10m / s.

[0030] (3) Roll the gold wire with a special precision rolling mill for gold strips (gold strip calender KPS-Y4), and process it into a gold strip of the target size. The width tolerance ...

Embodiment 2

[0034] A bonding gold ribbon, its composition and content (percentage by weight) are as follows: Au 99.9979%, Be 0.0006%, Cu 0.0004%, Fe 0.0003%, Mg 0.0003%, Ag 0.0005% and other impurities 0.001%.

[0035] The preparation method of the bonding gold ribbon is the same as that of Example 1.

Embodiment 3

[0037] A bonding gold ribbon, its composition and content (percentage by weight) are as follows: Au 99.9971%, Be 0.0009%, Cu 0.0005%, Fe 0.0003%, Mg 0.0003%, Ag 0.0009% and other impurities 0.001%.

[0038] The preparation method of the bonding gold ribbon is the same as that of Example 1.

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Abstract

The invention discloses a bonding gold ribbon and a preparation method thereof. The bonding gold ribbon includes the following components in weight percentage: 99.99%≤Au<100%, 0<Be≤0.001%, 0<Cu≤0.003%, 0<Fe≤0.001%, 0<Mg≤0.001%, and 0<Ag≤0.003%. The invention optimizes the formula of the bonded gold ribbon, significantly improves the mechanical properties of the bonded gold ribbon, makes it have suitable tensile strength and elongation, and meets the bonding requirements. The bonding gold strip prepared by the invention has stable and reliable transmission, high current resistance, firm connection, high dimensional accuracy, width tolerance of ±1%, and thickness tolerance of ±0.0002mm, belonging to high-precision products.

Description

technical field [0001] The invention belongs to the technical field of bonding materials, and in particular relates to a bonding gold ribbon and a preparation method thereof. Background technique [0002] Bonding is an important step in the production of integrated circuits, an operation that connects circuit chips to lead frames. Both the bonding gold ribbon and the bonding gold wire are inner leads used for electrical connection between the input / output bonding points of the on-chip circuit and the inner contact points of the lead frame during the assembly of semiconductor devices and integrated circuits. However, the effect of bonding gold ribbon and bonding gold wire is different. Due to the current skin effect, gold wires and gold ribbons with the same cross-sectional area can bear different currents, and the maximum current that gold ribbons can withstand is much higher than that of gold wires. Especially in the military industry, the battlefield environment is speci...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C5/02B21C37/04C22F1/14H01L23/49
CPCC22C5/02B21C37/04C22F1/14H01L23/49
Inventor 周钢范传勇张知行
Owner 上杭县紫金佳博电子新材料科技有限公司
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