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Thin film encapsulation material and manufacturing method thereof, thin film encapsulation structure and electronic device

A technology of thin film packaging and manufacturing methods, applied in the direction of electric solid devices, electrical components, semiconductor devices, etc., can solve the problems of poor thermal stability, etc., and achieve good film formation, improved effect, improved thermal stability and light transmittance Effect

Inactive Publication Date: 2020-10-16
EVERDISPLAY OPTRONICS (SHANGHAI) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] In view of this, the application provides a thin film packaging material to solve the problem of poor thermal stability of existing thin film packaging materials

Method used

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  • Thin film encapsulation material and manufacturing method thereof, thin film encapsulation structure and electronic device
  • Thin film encapsulation material and manufacturing method thereof, thin film encapsulation structure and electronic device
  • Thin film encapsulation material and manufacturing method thereof, thin film encapsulation structure and electronic device

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Embodiment Construction

[0045] Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this application will be thorough and complete, and will fully convey the concept of the example embodiments to those skilled in the art. The same reference numerals denote the same or similar structures in the drawings, and thus their repeated descriptions will be omitted.

[0046] The present invention provides a new thin film packaging material, which includes:

[0047] Photoinitiator and the compound synthesized by adamantyl ferrocene unit and acrylate functional group; The structure of said compound is shown in formula one or formula two:

[0048]

[0049]

[0050] Among them, n is an integer from 1 to 30, m is an integer from 0 to 30, R1 and R2 are hydrogen, alkyl or cycloalkyl; L...

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Abstract

The invention provides a thin film encapsulation material and a manufacturing method thereof, a thin film encapsulation structure and an electronic device. An adamantyl ferrocene unit is introduced into a main chain or side group of an acrylate monomer, and the structural characteristics of the adamantyl ferrocene compound are utilized to enhance the thermal stability and light transmittance of the organic layer, so that the finally formed polymer film has favorable film-forming property, thereby enhancing the thin film encapsulation effect.

Description

technical field [0001] The present application relates to the field of display technology, in particular to a thin-film packaging material and a manufacturing method thereof, a thin-film packaging structure and electronic devices. Background technique [0002] Organic electroluminescent devices (OLEDs) are known as the most promising display devices due to their characteristics of self-luminescence, high brightness, high contrast, low operating voltage, and flexible display. In recent years, with the development of curved screens and foldable display devices, various bendable flexible OLED display devices have been developed. [0003] A flexible OLED display device generally includes a substrate, an electroluminescent element on the substrate, and a thin film encapsulation structure on the electroluminescent element. For flexible OLED devices, the encapsulation effect of the thin-film encapsulation structure directly affects its reliability and service life. Therefore, how ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08F230/04C08F2/50C08J5/18H01L23/29
CPCC08F230/04C08F2/50C08J5/18H01L23/293C08J2343/00
Inventor 俞云海
Owner EVERDISPLAY OPTRONICS (SHANGHAI) CO LTD