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Vehicle microphone and manufacturing process thereof

A manufacturing process and microphone technology, which is applied in the direction of electrostatic transducer microphones, sensors, electrical components, etc., can solve the problem of low stability of vehicle microphones

Inactive Publication Date: 2020-10-20
荣成歌尔微电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The main purpose of the present invention is to provide a vehicle microphone and its manufacturing process, aiming to solve the technical problem of the low stability of the vehicle microphone in the extreme environment in the prior art

Method used

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  • Vehicle microphone and manufacturing process thereof
  • Vehicle microphone and manufacturing process thereof
  • Vehicle microphone and manufacturing process thereof

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Embodiment Construction

[0054] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0055] It should be noted that all directional indications (such as up, down, left, right, front, back...) in the embodiments of the present invention are only used to explain the relationship between the components in a certain posture (as shown in the accompanying drawings). Relative positional relationship, movement conditions, etc., if the specific posture changes, the directional indication will also change accordingly.

[0056]In addition, the d...

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Abstract

The invention provides a vehicle microphone and a manufacturing process thereof. The manufacturing process comprises the following steps: determining an installation position of an ASIC chip on a circuit board; smearing adhesive glue in the installation position, wherein the smeared area is 60%-80% of the area of the installation position; coating the edge of the installation position with sealant; installing the ASIC chip on the bonding glue and the sealant; installing an MEMS chip on the circuit board; and welding a conductive wire between the MEMS chip and the ASIC chip to enable the MEMS chip to be electrically connected with the ASIC chip. According to the technical scheme of the invention, the adhesive is sealed between the ASIC chip and the circuit board through the sealant, therebyavoiding the reduction of the adhesive capability caused by the adhesive in an extreme environment, and improving the stability of a product.

Description

technical field [0001] The invention relates to the field of microphone production, in particular to a production process of a vehicle microphone and a vehicle microphone. Background technique [0002] When making a MEMS chip MIC (Micro Electro Mechanical System Microphone, MEMS chip), its ASIC (Application Specific Integrated Circuit, ASIC chip) is usually bonded to the circuit board by glue to avoid WB welding (mechanical welding, such as thermal The ASIC chip shakes during pressure welding, ultrasonic welding or thermosonic welding, etc.). There are many types of glue materials, and most of them choose epoxy glue as the adhesive for ASIC chips and circuit boards. However, car microphones are often in extreme environments during the use of cars, and epoxy glue has the characteristics of water absorption. , For example, under high temperature and high humidity conditions, the glue absorbs moisture and water, which will affect the bonding ability of the adhesive, thus great...

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Application Information

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IPC IPC(8): H04R19/04H04R31/00
CPCH04R19/04H04R31/00
Inventor 鹿焕伟张加超
Owner 荣成歌尔微电子有限公司
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