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Multilayer flexible circuit board and manufacturing method thereof

A technology of flexible circuit boards and manufacturing methods, which is applied in the directions of multilayer circuit manufacturing, printed circuit manufacturing, chemical instruments and methods, etc., and can solve problems such as low yield rate, many processes, and low efficiency

Pending Publication Date: 2020-10-23
SONGYANG ELECTRONICS MATERIAL KUSN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This kind of multi-layer board manufacturing method has many processes, only sheet pressing and curing, low efficiency and low yield

Method used

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  • Multilayer flexible circuit board and manufacturing method thereof
  • Multilayer flexible circuit board and manufacturing method thereof
  • Multilayer flexible circuit board and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0053] Embodiment: the following are specific embodiments and comparative examples of the present invention, and test results thereof, see Table 1 and Table 2, and the unit of thickness of each layer in the table is μm:

[0054] Table 1:

[0055]

[0056] Table 2

[0057]

[0058] Embodiment 1-5 is a four-layer board, and the preparation method is as follows:

[0059] Step 1: Take a single-sided adhesive-free copper foil substrate 10, and laminate the PET film on the side of the first copper foil layer 11 away from the first polyimide layer 12, wherein the lamination condition is a lamination temperature of 50-120°C , The pressing pressure is 1-2kg and the pressing speed is 3-20rpm;

[0060] Step 2: Carry out roll-to-roll etching of the double-sided adhesive-free copper foil substrate 30 to form double-sided circuits, and obtain the etched double-sided adhesive-free copper foil substrate;

[0061] Step 3: Coating a layer of adhesive layer 20 on the first polyimide lay...

Embodiment 6-8

[0067] Embodiment 6-8 is a three-layer board, and the preparation method is as follows:

[0068] Step 1: Take a single-sided adhesive-free copper foil substrate 10, and laminate the PET film on the side of the first copper foil layer 11 away from the first polyimide layer 12, wherein the lamination condition is a lamination temperature of 50-120°C , The pressing pressure is 1-2kg and the pressing speed is 3-20rpm;

[0069] Step 2: Carry out roll-to-roll etching of the double-sided adhesive-free copper foil substrate 30 to form double-sided circuits, and obtain the etched double-sided adhesive-free copper foil substrate;

[0070] Step 3: Coating a layer of adhesive layer 20 on the first polyimide layer 12 of the single-sided adhesive-free copper foil substrate 10 laminated with PET film, and pre-baking in a coating oven for a short time to obtain the glue coating After the single-sided copper foil substrate;

[0071] Step 4: Press the coated single-sided copper foil substrate...

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Abstract

The invention relates to a multilayer flexible circuit board. The multilayer flexible circuit board comprises a double-sided adhesive-free copper clad laminate and at least one single-sided adhesive-free copper clad laminate, wherein the double-sided adhesive-free copper foil substrate and the single-sided adhesive-free copper foil substrate are bonded through an adhesive layer; the single-sided adhesive-free copper foil substrate comprises a first copper foil layer and a first polyimide layer which are arranged in sequence; a PET film is attached to on the surface, far away from the first polyimide layer, of the first copper foil layer, the double-sided adhesive-free copper foil substrate comprises a second copper foil layer, a second polyimide layer and a second copper foil layer which are arranged in sequence, and the single-sided adhesive-free copper foil substrate and the double-sided adhesive-free copper foil substrate are formed by roll-to-roll direct pressing. The single-sidedboard and the double-sided board are directly pressed and formed in a roll-to-roll manner through the pressing machine, so that a plurality of cutting procedures, sheet pressing and curing proceduresand the like are omitted, the working process is simplified, and the working efficiency is improved.

Description

technical field [0001] The invention relates to a flexible circuit board, in particular to a multilayer flexible circuit board and a manufacturing method thereof. Background technique [0002] At present, the manufacturing method of multi-layer boards is mostly to etch the single-sided or double-sided copper foil substrate to form the circuit, then cut the single-sided or double-sided circuit into sheets, and then cut the pure rubber, through fast pressing or pressure transmission. The method is to use pure glue to combine single-sided or double-sided boards through pure glue to form the required multi-layer board. This kind of multi-layer board manufacturing method has many processes, can only be laminated and matured in sheet form, and has low efficiency and low yield. Contents of the invention [0003] In order to overcome the above-mentioned defects, the present invention provides a multi-layer flexible circuit board. In the manufacturing process of the circuit board,...

Claims

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Application Information

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IPC IPC(8): H05K1/14H05K1/02H05K3/02H05K3/46B32B27/36B32B27/06B32B15/20B32B15/09B32B15/08B32B27/28B32B7/12B32B7/06
CPCB32B7/06B32B7/12B32B15/08B32B15/09B32B15/20B32B27/281B32B27/36B32B2457/08H05K1/02H05K1/144H05K3/02H05K3/4611
Inventor 徐玮鸿章玉敏罗宵周文贤
Owner SONGYANG ELECTRONICS MATERIAL KUSN
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