Through hole filling method and structure
A filling method and support structure technology, which is applied to semiconductor/solid-state device parts, semiconductor devices, electrical components, etc., can solve the problem of low filling yield of through holes
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[0041] The through hole filling method and structure proposed by the present invention will be further described in detail below in conjunction with the drawings and specific embodiments. According to the following description and claims, the advantages and features of the present invention will be clearer. It should be noted that the drawings are in a very simplified form and all use imprecise proportions, which are only used to conveniently and clearly assist in explaining the purpose of the embodiments of the present invention.
[0042] In addition, unless otherwise specified, features in different embodiments of the present invention can be combined with each other. For example, a feature in the second embodiment can be used to replace the corresponding or functionally same or similar feature in the first embodiment, and the obtained embodiment also falls within the scope of disclosure or description of the present application.
[0043] The core idea of the present invention...
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