Device for replacing dynamic gas lock online

Abstract

The invention discloses a device for replacing a dynamic gas lock online, and the device comprises a buffering cavity which is used for temporarily storing a new dynamic gas lock connected from the exterior of a vacuum cavity under the isolation from the interior of the vacuum cavity, and temporarily storing an old dynamic gas lock fed from the interior of the vacuum cavity under the isolation from the exterior of the vacuum cavity; a conveying and loading and unloading mechanism which is used for accessing a new dynamic gas lock through the buffer cavity, conveying the new dynamic gas lock toa mounting point in the vacuum chamber for mounting, and conveying an old dynamic gas lock dismounted from the mounting point out of the vacuum cavity through the buffer cavity; and a sealing mechanism which is used for sealing a matching surface between the conveying and loading and unloading mechanism and the buffer cavity after one end part of the conveying, loading and unloading mechanism enters the buffer cavity. According to the invention, the dynamic gas lock can be replaced online in a non-stop manner, so that the time is greatly saved, and the shipment quantity of a photoetching machine is increased.

Description

technical field [0001] The invention relates to the technical fields of integrated circuits and photolithography, in particular to a device capable of replacing dynamic gas locks online. Background technique [0002] Please refer to figure 1 , figure 1 It is a structural schematic diagram of a photolithography vacuum chamber. like figure 1 As shown, in eg 13.5nm EUV lithography, a silicon wafer 13 is placed on a silicon wafer platform 12 in the lower vacuum chamber 10 for photolithography. The light passes through the lens group of the lens system and is projected onto the silicon wafer 13 according to a certain propagation direction. The lens system is located in the upper vacuum chamber 11 . [0003] The extreme ultraviolet photoresist (photoresist) used in photolithography will generate a large amount of acid gas 14 (outgassing) during the exposure process, and it will be discharged into the vacuum chamber 10,11. The acid gas 14 will contaminate the lens, especially...

AI Technical Summary

Problems solved by technology

[0005] However, as the exposure time increases, dirt will also appear on the dynamic gas lock 15 due to the long-term accumulation of acid gas 14

If the dynamic gas lock 15 is not replaced in time, the intensity of the exposure light will be affected, thereby affecting the exposure result

[0006] However, the commonly used method of replacing the dynamic gas lock membrane requires stopping the machine and opening the vacuum chamber

Moreover, after replacing the dynamic gas lock film, the chamber needs to be evacuated again, which will take about 3 days, which will greatly affect the shipments of extreme ultraviolet lithography machines

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