Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!
A process for eliminating micro-short circuits in the production of functional chips by using a megohmmeter
What is Al technical title?
Al technical title is built by PatSnap Al team. It summarizes the technical point description of the patent document.
A process method and megohmmeter technology, applied in the direction of circuit, semiconductor/solid-state device testing/measurement, electrical components, etc., can solve problems such as inability to cut with sharp blades, so as to avoid secondary defects, improve pass-through rate, and reduce scrap rate Effect
Active Publication Date: 2022-04-29
GUANGZHOU TOUCHKIT PHOTOELECTRIC TECH
View PDF6 Cites 0 Cited by
Summary
Abstract
Description
Claims
Application Information
AI Technical Summary
This helps you quickly interpret patents by identifying the three key elements:
Problems solved by technology
Method used
Benefits of technology
Problems solved by technology
[0004] The purpose of the invention provided by the present invention is to provide a process method for eliminating micro-short circuits in the production of functional chips by using a megohmmeter. position, and can solve the problem that the micro-short circuit with a width of silver paste line below 130um cannot be cut with a sharp blade
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more
Image
Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
Click on the blue label to locate the original text in one second.
Reading with bidirectional positioning of images and text.
Smart Image
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0029] The invention provides a technical scheme, such as Figure 1 As shown in, a process method for eliminating micro short circuit in the production of functional chips by using a megohmmeter comprises the following specific steps:
[0030] Step 1. Prepare fixture: multimeter, megohmmeter and HD video microscope with m European file. The model of multimeter is victorvc9807a +, the model of megohmmeter is victorvc60b +, and the model of HD video microscope is TTL HK, 15-45 times.
[0031] Step 2. After the silver paste laser etching, use a multimeter to measure and check the silver paste line micro short circuit. The multimeter is adjusted to 200m Ω for measurement. The two pointers contact two adjacent ITO channels. The multimeter shows that it is a micro short circuit if it is greater than 0.1M Ω. The ITO channel is the test channel impedance, which is greater than 0.1M Ω, and it is a micro short circuit between 0 and tens of M Ω.
[0032] Step 3: select the voltage value of th...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More
PUM
Login to View More
Abstract
The invention provides a process method for eliminating micro-short circuits in the production of functional chips by using a megohmmeter, which relates to the technical field of eliminating micro-short circuits of functional chips, and includes the following steps: S1, preparing a jig, S2, using a multimeter to measure, S3, selecting the micro-short circuit The voltage value of the ohmmeter, S4, touch the two pointers of the megohmmeter to bind the pad, S5, eliminate the impurities of the micro-short circuit, S6, use a high-definition video microscope to observe, S7, do a functional test, S8, select the voltage of the megohmmeter , S9, eliminate short circuit failure. In the present invention, the micro-short circuit will affect the touch accuracy and linearity, and it is also an NG item in the program debugging. The micro-short circuit of the functional chip is a defective product. If it cannot be repaired, it needs to be scrapped. This process can eliminate the micro-short circuit, greatly Improve the pass-through rate of functional film production and reduce the scrap rate. Compared with the old technology, using a megohmmeter to ablate the impurities in the micro-short circuit is simple and fast, with high accuracy, and is not easy to cause secondary defects, such as cutting off the line when cutting the short-circuit position.
Description
technical field [0001] The invention relates to the technical field of eliminating the micro short circuit of functional chips, in particular to a process method for eliminating the micro short circuit in the production of functional chips by using a megger. Background technology [0002] For the micro short circuit in the production of functional films, first use the high-definition video microscope to check and confirm the position of the short circuit, and then the employees cut off the short circuit with a sharp blade under the high-definition video microscope. Due to the large line spacing and linewidth of the silver paste line, it is easy to cut. [0003] The difficulty of this process lies in finding the location of the short circuit. Because the micro short circuit is generally caused by the connection of two or more silver slurry lines by dust and sundries in the air, silver slurry sundries, fiber sundries during production, employee hair shavings and other impurities, t...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More
Application Information
Patent Timeline
Application Date:The date an application was filed.
Publication Date:The date a patent or application was officially published.
First Publication Date:The earliest publication date of a patent with the same application number.
Issue Date:Publication date of the patent grant document.
PCT Entry Date:The Entry date of PCT National Phase.
Estimated Expiry Date:The statutory expiry date of a patent right according to the Patent Law, and it is the longest term of protection that the patent right can achieve without the termination of the patent right due to other reasons(Term extension factor has been taken into account ).
Invalid Date:Actual expiry date is based on effective date or publication date of legal transaction data of invalid patent.