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PC board surface hardness strengthening process

A technology of surface hardness and PC board, applied in the direction of coating, etc., can solve the problem that the strength of PC board cannot reach the strength, achieve high hardness, increase wear resistance, and high material utilization rate

Inactive Publication Date: 2020-11-06
无锡惠臣塑胶科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, the way to harden the surface of PC boards in the market is to manually transport the PC boards to the cutting machine, cut the PC boards into some fixed sizes according to the processing requirements, and then transport them to the coating machine to treat the newly cut PC boards. Hardening coating, but the hardening coating work is only a one-step process, and the strength of hardening the PC board cannot reach the required strength

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0013] The preferred embodiments of the present invention will be described below. It should be understood that the preferred embodiments described here are only used to illustrate and explain the present invention, and are not used to limit the present invention.

[0014] A PC board surface hardness enhancement process, including the following steps: Step 1: PC roll unwinding: the drive device drives the roll PC board roll to rotate and enters the PC board roll roll unwinding traction device; Step 2: protective film peeling: passing The PC sheet coil unwinding traction device detects the tension between the traction and the coating, and then enters the peeling protective film peeling device to peel the protective film, and the peeled protective film is wound into the protective film winding device; Step 3: Hardening liquid coating Cloth: The peeling surface of the peeled PC coil enters the continuous coating device for polymer hardening liquid coating, and then passes through the...

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PUM

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Abstract

The invention relates to the technical field of PC board manufacturing processes, in particular to a PC board surface hardness strengthening process. The process comprises the following steps of: 1, PC roll unreeling: driving a coiled PC board coiled material to rotate by a driving device to enter a PC board coiled material unreeling traction device; 2, protective film stripping: detecting the tension between traction and coating through the PC board coiled material unreeling traction device, then enabling the PC board coiled material to enter a stripping protective film stripping device to strip the protective film, and winding the stripped protective film into a protective film winding device; 3, hardening liquid coating: sending a stripped face of the stripped PC coiled material into acontinuous coating device for coating with macromolecule hardening liquid, and then passing the stripped PC coiled material through a vacuum suction traction roller device; through adoption of the PCboard surface coating assembly, the heat curing assembly and the ultraviolet UV curing assembly, the surface of the PC board coiled material is coated with the multiple hardened coatings, the surfacehardness reaches at least 6H, and meanwhile the PC board coiled material is not prone to being scratched.

Description

Technical field [0001] The invention relates to the technical field of PC board manufacturing technology, in particular to a PC board surface hardness enhancement technology. Background technique [0002] PC board is a high-performance engineering plastic, processed by polycarbonate (PC) resin. It has the characteristics of high transparency, light weight, impact resistance, sound insulation, heat insulation, flame resistance, and anti-aging. It is a high Technology, comprehensive performance is extremely excellent, energy-saving and environmentally friendly plastic sheet. [0003] The use of PC boards has been developed in the direction of high-functionality and specialization. In view of the rapid development of my country's PC board production capabilities and market demand, especially the establishment of multiple domestic planning devices, coupled with the rapid development of the automobile industry, the future In recent years, my country's PC industry has entered a new stage...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J7/046C09D7/62C09D133/04C09D133/12C08L69/00C08L67/02
CPCC08J7/046C08J7/042C09D7/62C09D133/04C09D133/12C08K2003/385C08J2369/00C08J2433/04C08J2433/12C08J2367/02C08K9/10C08K3/38
Inventor 张伟张飞李江彬张东华郭亚辉
Owner 无锡惠臣塑胶科技有限公司