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A method for effectively avoiding tin leakage through holes and a pcb board

A technology of PCB board and tin leakage, which is applied in the manufacture of printed circuits, electrical components, printed circuits, etc., can solve problems such as through-hole tin leakage, poor upper parts, and chips that cannot be placed on the back of the window area, so as to avoid through-holes. The effect of leaking tin through holes and increasing the space of cloth parts

Active Publication Date: 2021-10-22
INSPUR SUZHOU INTELLIGENT TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] During the PCB design process, some through holes (via) will be required to be opened on the area of ​​the stencil (such as the heat dissipation pad), but in the PCBA process, these through holes will leak tin when brushing solder paste
The current solution is to use green oil to plug the hole on one side, but due to the limited depth of the plug hole of the green oil plug hole, some air will be left in the hole, and the air in the through hole will expand during the welding process, making the upper part defective ;In addition, because of the need for plug holes on one side, the other side of the through hole on the heat dissipation pad cannot be opened, so the chip with the heat dissipation pad cannot be placed on the back of the window area, which has limitations in PCB design layout

Method used

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  • A method for effectively avoiding tin leakage through holes and a pcb board
  • A method for effectively avoiding tin leakage through holes and a pcb board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] Such as figure 1 As shown, this embodiment provides a method for effectively avoiding tin leakage through holes, including the following steps:

[0025] S1, identifying the position of the through hole in the stencil area;

[0026] S2, inserting a copper core into each through hole in the stencil area according to the position of the through hole.

[0027] In this method, the copper core is stuffed into the through hole in the stencil area. When the PCB board passes through the process of brushing solder paste on the surface, because the space in the via hole has been occupied by the copper core (specifically, the distance between the surface layer of the PCB and the copper core is only 1 / 6 board thickness depth), the distance from the surface layer to the copper core is relatively close, tin will flow into the hole, and the air in the hole will be squeezed out. During the reflow soldering process, it will not cause poor welding due to the thermal expansion of the air...

Embodiment 2

[0041] This embodiment provides a PCB board, on which copper cores are plugged into the through holes in the stencil area of ​​the PCB board, and the PCB board is made by the method described in Embodiment 1.

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PUM

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Abstract

The invention discloses a method for effectively avoiding tin leakage through through holes and a PCB board, identifying the position of the through hole in the stencil opening area; according to the position of the through hole, inserting a copper core into each through hole in the stencil opening area. The present invention inserts copper cores into the through holes in the stencil opening area, so that tin leakage will not occur in the through holes in the area where tinning is required, effectively reducing the problem of defective upper parts caused by the air in the holes when reflow soldering occurs; Chips with heat dissipation pads can also be placed on the back of the design area with windows, increasing the layout space.

Description

technical field [0001] The invention relates to the field of PCB board production, in particular to a method for effectively avoiding tin leakage through through holes and a PCB board. Background technique [0002] During the PCB design process, some through holes (via) will be required to be opened on the area of ​​the stencil (such as the heat dissipation pad), but in the PCBA process, these through holes will leak tin when solder paste is applied. The current solution is to use green oil to plug the hole on one side, but due to the limited depth of the plug hole of the green oil plug hole, some air will be left in the hole, and the air in the through hole will expand during the welding process, making the upper part defective ;In addition, because of the need for single-sided plug holes, the other side of the through hole on the heat dissipation pad cannot have a window, so the chip with the heat dissipation pad cannot be placed on the back of the window area, which has l...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00
CPCH05K3/0094
Inventor 杜红红
Owner INSPUR SUZHOU INTELLIGENT TECH CO LTD