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Calculation method for motion trail of ultrasonic elliptical vibration cutting technology

A technology of elliptical vibration and motion trajectory, which is applied in the calculation of motion trajectory and the calculation of motion trajectory of ultrasonic elliptical vibration cutting technology, which can solve cutting problems and achieve the effects of reducing the difficulty of calculation, increasing the distance threshold, and good versatility

Active Publication Date: 2020-11-10
HARBIN INST OF TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] The purpose of the present invention is to solve the problem that the existing motion expression is difficult to be used to calculate the ultrasonic wave corresponding to other types of surfaces because it only has the motion speed in the cutting direction and always uses a certain fixed point as the reference of the overall motion trajectory. Problems with Motion Trajectory of Elliptical Vibration Cutting Technology

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  • Calculation method for motion trail of ultrasonic elliptical vibration cutting technology
  • Calculation method for motion trail of ultrasonic elliptical vibration cutting technology
  • Calculation method for motion trail of ultrasonic elliptical vibration cutting technology

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specific Embodiment approach 1

[0051] Specific implementation mode one: combine Figure 1 to Figure 2 Illustrate this embodiment, a kind of calculation method that is used for ultrasonic elliptical vibration cutting technology motion trajectory of this embodiment, it comprises the following steps:

[0052] Step 1: Use the method of homogeneous coordinate transformation to study the motion trajectory expression of the ultrasonic elliptical vibration cutting technology corresponding to the oblique straight line from a new perspective. The main body of the ultrasonic elliptical vibration cutting device is composed of a piezoelectric ceramic sheet group, a horn and a tool 1 . Under the action of electric excitation at a certain frequency, the piezoelectric ceramic sheet group produces a displacement output with the same frequency as the electric excitation, and the displacement output is amplified by the horn to make the tool 1 move along a certain path. When the frequency of electrical excitation is the natur...

specific Embodiment approach 2

[0072] Specific implementation mode two: combination figure 1 with figure 2 To illustrate this embodiment, the motion trajectory method of the ultrasonic elliptical vibration cutting technology proposed in this embodiment is applicable to different types and forms of ultrasonic elliptical vibration cutting devices. The ultrasonic elliptical vibration cutting device described in step 1 is a non-resonance type or a resonance type, and the resonance type is a longitudinal vibration-flexural vibration composite form or a bending vibration-flexural vibration composite form or a longitudinal vibration-longitudinal vibration composite form. It is also applicable to other forms of the non-resonant type and the resonant type, such as bending vibration-bending vibration combination, longitudinal vibration-longitudinal vibration combination, etc. Although the ultrasonic elliptical vibration cutting devices are not the same, their internal movement trajectory synthesis principle is the ...

specific Embodiment approach 3

[0073] Specific implementation mode three: combination figure 1 with figure 2 Describe this embodiment, this embodiment has multiple methods to determine the discrete point sequence P i (y i ,z i ) (i=1,2,...,m). If the moving path 6 is a function expression, discrete points can be extracted by means of equal variable intervals or equal chord lengths according to the nature of the function; if the moving path 6 is difficult to express with a function or has no functional expression, a series of discrete points can be extracted from the curve point, the sequence of discrete points will be used as P i (y i ,z i ) (i=1,2,...,m). Other compositions and connections are the same as those in Embodiment 1 or Embodiment 2.

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Abstract

The invention discloses a calculation method for a motion trail of an ultrasonic elliptical vibration cutting technology, and relates to a calculation method for a motion trail. The method aims to solve the problem that an existing ultrasonic elliptical vibration cutting technology motion expression only has the motion speed in the cutting direction, a certain fixed point serves as the reference standard of the overall motion trail all the time, and therefore the ultrasonic elliptical vibration cutting technology motion trail corresponding to other types of surfaces is difficult to calculate.The invention provides a calculation method for a motion trail of an ultrasonic elliptical vibration cutting technology. According to the method, a motion expression of the ultrasonic elliptical vibration cutting technology corresponding to any curve in a cutting plane is researched from the perspective of interpolation approximation on the basis of homogeneous coordinate transformation. Accordingto the method, the problem that the application range of an existing expression is limited can be solved, and the application range of the motion expression is widened. The method is used for calculating the motion trail of the ultrasonic elliptical vibration cutting technology.

Description

technical field [0001] The invention relates to a calculation method of a motion track, in particular to a calculation method for a motion track of an ultrasonic elliptical vibration cutting technology, and belongs to the technical field of ultra-precision cutting. Background technique [0002] Infrared hard and brittle materials, such as calcium fluoride, single crystal germanium, gallium arsenide, and single crystal silicon, have good infrared light transmission and are important materials in the field of infrared optics applications. The special infrared optical requirements make the above materials designed into surface functional parts with complex geometric structures, such as sinusoidal surfaces, microlens arrays, etc. In order to ensure the quality of the machined surface, the cutting depth of the traditional ultra-precision cutting process is usually controlled at about 1 μm. The lower cutting depth not only reduces the processing efficiency, but also significantly ...

Claims

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Application Information

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IPC IPC(8): G05B19/19G06F17/15
CPCG05B19/19G06F17/15G05B2219/34136
Inventor 王爱博赵清亮郭兵
Owner HARBIN INST OF TECH