Preparation method of high-coercivity sintered neodymium-iron-boron magnet
A high coercive force, neodymium iron boron technology, applied in the direction of magnetic objects, inductance/transformer/magnet manufacturing, magnetic materials, etc., can solve the problem that the coercive force is not high enough to improve the coercive force and coercive force high effect
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0023] In this embodiment, NdFeB alloy powder with an average particle size of 2 μm is used, and the aforementioned NdFeB alloy powder is divided into three parts A, B and C.
[0024] A powder does not do any treatment.
[0025] Use magnetron sputtering equipment to coat B powder with Tb film layer and Pr film layer successively, and form a Tbx+Prz mixed film layer on its surface, that is, do not process B powder to form M metal layer, wherein the average thickness of the Tb film layer is x is 1nm, and the thickness z of the Pr film is controlled at 10nm.
[0026] Using magnetron sputtering equipment, C powder is coated with Tb film layer, W film layer and Pr film layer successively, forming a Tbx+Wy+Prz mixed film layer on the surface, wherein the average thickness of the Tb film layer is 1nm, and the W film layer The average thickness y of the Pr film is 1nm, and the thickness of the Pr film is controlled at 10nm.
[0027] Three kinds of neodymium-iron-boron alloy powders ...
Embodiment 2
[0034] In this embodiment, NdFeB alloy powder with an average particle size of 3 μm is used, and the aforementioned NdFeB alloy powder is divided into three parts A, B and C.
[0035] A powder does not do any treatment.
[0036] Use magnetron sputtering equipment to coat Dy film layer and PrNd film layer successively on B powder, and form Dyx+(PrNd)z mixed film layer on its surface, wherein the average thickness x of Dy film layer is 5nm, and the thickness z of PrNd film layer is controlled at 15nm .
[0037]Use magnetron sputtering equipment to successively coat Dy film layer, Mo film layer and PrNd film layer on C powder, form Dyx+Moy+(PrNd)z mixed film layer on its surface, wherein the average thickness of Dy film layer is x is 5nm, Mo The average thickness y of the film layer is 10nm, and the thickness of the PrNd film layer is controlled at 15nm.
[0038] The processed NdFeB alloy powders A, B, and C are respectively oriented and formed in a magnetic field of 1.8T, and ...
Embodiment 3
[0045] In this embodiment, NdFeB alloy powder with an average particle size of 4.1 μm is used, and the aforementioned NdFeB alloy powder is divided into three parts A, B and C.
[0046] A powder does not do any treatment.
[0047] Use magnetron sputtering equipment to coat Dy film and Nd film layer successively on the B powder, and form a Dyx+Ndz mixed film layer on its surface, wherein the average thickness x of the Dy film layer is 10nm, and the thickness z of the Nd film layer is controlled at 20nm.
[0048] Using magnetron sputtering equipment, C powder is coated with Dy film layer, Mo film layer and Nd film layer successively, and a Dyx+Moy+Ndz mixed film layer is formed on the surface, wherein the average thickness of the Dy film layer is 10nm, and the Mo film layer The average thickness y of the film is 5nm, and the thickness of the Nd film is controlled at 20nm.
[0049] The three kinds of neodymium-iron-boron alloy powders A, B, and C after treatment were respectivel...
PUM
Property | Measurement | Unit |
---|---|---|
thickness | aaaaa | aaaaa |
thickness | aaaaa | aaaaa |
thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com