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Spacer structure for double-sided cooling power module and method of manufacturing same

A double-sided cooling, power module technology, applied in the fields of semiconductor/solid-state device manufacturing, electrical components, semiconductor devices, etc., can solve the problems of deterioration of electrical characteristics of semiconductor chips, burning of semiconductor chips, etc., to improve electrical characteristics and durability, improve Wetting effect

Pending Publication Date: 2020-11-10
HYUNDAI MOTOR CO LTD +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the growth of intermetallic compounds, the thin metal layer on the surface of the semiconductor chip is completely depleted, and as a result, there is a problem that the electrical characteristics of the semiconductor chip deteriorate or the semiconductor chip is burned

Method used

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  • Spacer structure for double-sided cooling power module and method of manufacturing same
  • Spacer structure for double-sided cooling power module and method of manufacturing same
  • Spacer structure for double-sided cooling power module and method of manufacturing same

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Embodiment Construction

[0031] Hereinafter, the present disclosure will be described in detail with reference to the accompanying drawings. However, the present disclosure is not limited by the exemplary embodiments. The same reference numerals indicated in the various drawings designate components that perform substantially the same function.

[0032] The purpose and effect of the present disclosure can be naturally understood or made clearer from the following description, and are not limited to the following description. Also, in the description of the present disclosure, specific descriptions of known technologies related to the present disclosure will be omitted when it is determined that the specific descriptions may unnecessarily obscure the subject matter of the present disclosure.

[0033] figure 1 is a sectional view showing the structure of a double-sided cooling power module in the related art. Such as figure 1 As shown, in the prior art double-sided cooling power module, the upper an...

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Abstract

The invention discloses a spacer structure and a manufacturing method thereof. The spacer structure connects an insulating substrate and a semiconductor chip of a double-sided-cooled power module, andincludes: a conductive material layer which is composed of a composite material; an underlying plating layer disposed on the conductive material layer; and a copper plating layer disposed on the underlying plating layer, in which the copper plating layer is in contact with a joining material that joins the spacer to the semiconductor chip and the insulating substrate.

Description

[0001] Cross References to Related Applications [0002] This application claims priority from Korean Patent Application No. 10-2019-0054500 filed with the Korean Intellectual Property Office on May 9, 2019, the entire disclosure of which is hereby incorporated by reference. technical field [0003] The present invention relates to a spacer structure for a double-sided cooling power module and a manufacturing method thereof, and more particularly, to a spacer for electrically and physically connecting a semiconductor chip of a double-sided cooling power module with an insulating substrate structure and method of manufacture. Background technique [0004] A power module that appropriately transmits current supplied from a high-voltage battery to a driving motor is mainly used to operate a driving motor for an eco-friendly vehicle such as a hybrid car or an electric car. [0005] Power modules generate a lot of heat due to their very fast switching operations. Since the gene...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/492H01L21/60
CPCH01L23/4924H01L24/83H01L24/29H01L2224/83379H01L2224/29147H01L23/3735H01L23/4334H01L23/3736H01L21/4871H01L2224/33181H01L2224/32245H01L2224/32238H01L2224/32503H01L2224/29111H01L2224/04026H01L2224/05155H01L2224/05644H01L2224/83815H01L2224/83455H01L2224/83447H01L2224/83444H01L2224/83439H01L2224/83464H01L24/32H01L2924/014H01L2924/00014H01L2924/00015H01L23/367H01L23/28H01L23/3672H01L24/27
Inventor 朴圣源金现旭金泰华朴准熙李贤求
Owner HYUNDAI MOTOR CO LTD