Printed circuit board production and manufacturing process
A printed circuit board and manufacturing process technology, applied in the direction of printed circuit manufacturing, printed circuit, printed circuit drying, etc., can solve the problems of different degrees of heating of the circuit board, long time for a single circuit board, damage to the surface of the circuit board, etc., to speed up the uniformity The effect of sexual diffusion, shortening drying time, and avoiding damage to the four corners
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[0031] In order to make the technical means, creative features, goals and effects achieved by the present invention easy to understand, the present invention will be further described below in conjunction with specific illustrations. It should be noted that, in the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined with each other.
[0032] Such as Figure 1 to Figure 5 As shown, a printed circuit board manufacturing process uses a positioning drying equipment, the positioning drying equipment includes a drying frame 1, a positioning unit 2, a driving unit 3, two side drying units 4, a connecting Plate 5, push cylinder 6 and plug-in drying unit 7, adopt the above-mentioned positioning drying equipment to prepare and granulate the inorganic compound fertilizer as follows:
[0033] S1. Positioning and clamping: open the sealing cover 27, put the formed circuit boards into each positioning unit 2 in turn, after put...
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