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Printed circuit board production and manufacturing process

A printed circuit board and manufacturing process technology, applied in the direction of printed circuit manufacturing, printed circuit, printed circuit drying, etc., can solve the problems of different degrees of heating of the circuit board, long time for a single circuit board, damage to the surface of the circuit board, etc., to speed up the uniformity The effect of sexual diffusion, shortening drying time, and avoiding damage to the four corners

Inactive Publication Date: 2020-11-13
盛春井
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to solve the above problems, the present invention provides a printed circuit board manufacturing process, which can solve the problem of fixing the four corners with screws, which takes a long time for a single circuit board, is not suitable for assembly line production, and the way of screw fixing may damage the circuit board The surface, and the position of the circuit board during drying is always the same, and the direction of the hot air is mostly blown from the surrounding to the middle, resulting in uneven heating of a single circuit board and different heating degrees of circuit boards in different positions.

Method used

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  • Printed circuit board production and manufacturing process
  • Printed circuit board production and manufacturing process
  • Printed circuit board production and manufacturing process

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Embodiment Construction

[0031] In order to make the technical means, creative features, goals and effects achieved by the present invention easy to understand, the present invention will be further described below in conjunction with specific illustrations. It should be noted that, in the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined with each other.

[0032] Such as Figure 1 to Figure 5 As shown, a printed circuit board manufacturing process uses a positioning drying equipment, the positioning drying equipment includes a drying frame 1, a positioning unit 2, a driving unit 3, two side drying units 4, a connecting Plate 5, push cylinder 6 and plug-in drying unit 7, adopt the above-mentioned positioning drying equipment to prepare and granulate the inorganic compound fertilizer as follows:

[0033] S1. Positioning and clamping: open the sealing cover 27, put the formed circuit boards into each positioning unit 2 in turn, after put...

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Abstract

The invention provides a printed circuit board production and manufacturing process. The printed circuit board production and manufacturing process is completed through cooperation of a drying frame,a positioning unit, a driving unit, two side face drying units, a connecting plate, a pushing air cylinder and an inserting type drying unit. According to the printed circuit board production and manufacturing process, the problems that in the mode of fixing four corners through screws, the time for a single circuit board is long, assembly line production is not suitable, the screw fixing mode maydamage the surface of the circuit board, the position of the circuit board is always unchanged in the drying process, and most of hot air blows from the periphery to the middle, uneven heating of thesingle circuit board, different heating degrees of circuit boards at different positions and the like can be solved.

Description

technical field [0001] The invention relates to the technical field of printed circuit board production and manufacturing, in particular to a printed circuit board production and manufacturing process. Background technique [0002] Printed circuit boards, also known as printed circuit boards, are providers of electrical connections for electronic components. The main advantage of using circuit boards is that they greatly reduce wiring and assembly errors, and improve automation and productivity. Printed circuit boards usually refer to The bare board is a circuit board without components. In the production process of the circuit board, it needs to be baked, and the organic solvent in the liquid ink is evaporated to solidify by using high-temperature hot air circulation. The traditional drying method Usually, the circuit board is placed on a baking rack for drying. However, during hot air drying, since the circuit board is light in weight, it cannot support the weight by itsel...

Claims

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Application Information

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IPC IPC(8): F26B11/18F26B21/00F26B25/02F26B25/18H05K3/00H05K3/22
CPCF26B11/18F26B21/001F26B21/004F26B25/02F26B25/18H05K3/0008H05K3/227
Inventor 盛春井
Owner 盛春井
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