Server assembly multilayer PCB and side embedded structure thereof

Abstract

The invention discloses a side embedded structure. The structure comprises a PCB substrate, the PCB substrate comprises a plurality of layers of circuit boards which are laminated and pressed, and aninsulating plate which is clamped between two adjacent layers of circuit boards. A mounting groove is formed in the side wall of the insulating plate, a connector is mounted in the mounting groove, aconnecting port of the connector faces the outer side of the mounting groove, and a pin of the connector is in signal connection with the corresponding circuit board. Thus, a part of connectors originally mounted on the surface of the PCB substrate are transferred into the mounting grooves, so that the number of connectors mounted on the surface of the PCB substrate is reduced, the occupation of the connectors on the PCB mounting area is reduced, and more PCB mounting area is saved; meanwhile, due to the fact that the connector is installed in a built-in mode, high-speed signals can be directly routed from the inner layer of the PCB through the pins, via holes do not need to be punched in the surface of the PCB substrate, and then loss of the high-speed signals caused by layer changing androuting is avoided. The invention also discloses a server assembly multilayer PCB, and the beneficial effects of the server assembly multilayer PCB are as described above.

Description

technical field [0001] The invention relates to the technical field of PCB, in particular to a side-mounted embedded structure. The invention also relates to a server assembly multilayer PCB. Background technique [0002] With the development of electronic technology in China, more and more electronic devices have been widely used. [0003] A server is an important part of electronic equipment and a device that provides computing services. Since the server needs to respond to and process service requests, generally speaking, the server should have the ability to undertake and guarantee services. According to the different types of services provided by the server, it is divided into file server, database server, application server, WEB server, etc. [0004] People's daily work and life are more and more communicated through the network, the amount of network data is also increasing, the performance requirements of the server are also higher, the power consumption is gettin...

AI Technical Summary

Problems solved by technology

Among them, wafer-level packaging, multi-chip packaging, system packaging, and three-dimensional stacked packaging are small packaging methods, but they are mostly used for IC parts, and their usage is limited, resulting in limited area savings

The use of HDI boards to replace through holes with blind buried holes can make the arrangement of parts more compact, but the number of parts distributed on the surface of the PCB cannot be reduced, resulting in limited area savings.

[0007] Therefore, how to reduce the occupation of the PCB installation area by the connector, save more PCB installation area, and avoid the loss of high-speed signals caused by layer-changing wiring is a technical problem faced by those skilled in the art.

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