Rigid-flex printed circuit board and manufacturing method thereof
A rigid-flex board and rigid-flex technology, which is applied in multi-layer circuit manufacturing, printed circuit manufacturing, and structural connection of printed circuits, can solve the problem of high production costs of rigid-flex boards and inconsistencies in the combination of rigid and flexible materials. Good, unstable conductivity of the product, etc., to achieve the effect of strong interlayer bonding, low processing difficulty, and small change in expansion and contraction
Inactive Publication Date: 2020-12-01
SHENZHEN HUALIN CIRCUIT TECH
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Problems solved by technology
[0009] In view of the above-mentioned defects of the prior art, the technical problem to be solved by the present invention is the disadvantages of high production cost of rigid-flex boards in the current technology, poor combination of rigid and flexible materials, resulting in unstable conductivity of the product
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[0041] Such as figure 1 Shown is a rigid-flexible board provided by the present invention, including a rigid-flexible substrate in the middle and several layers of metal layers on the upper and lower sides, wherein the rigid-flexible substrate includes a rigid substrate and a flexible substrate, and a rigid-flexible substrate is provided in the rigid substrate. Small unit window, the flexible substrate is embedded in the small unit window, a circuit pattern is formed on the rigid-flexible substrate, a cover film is attached to the outside of the flexible substrate, a protective film is attached to the cover film, and several layers of metal layers are laminated On the outside of the rigid-flexible substrate, the metal layers, the metal layer and the rigid-flexible substrate are combined through a prepreg, and there are electrical connections between the metal layer and the metal layer, between the metal layer and the rigid substrate, and between the metal layer and the flexible...
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Abstract
The invention discloses a rigid-flex printed circuit board. The flexible printed circuit board comprises a rigid-flexible combined substrate located in the middle and a plurality of metal layers on the upper side and the lower side. The rigid-flexible combined substrate comprises a rigid substrate and a flexible substrate. The flexible substrate is embedded in a small unit window formed in the rigid substrate; a circuit pattern is formed on the surface of the rigid-flexible combined substrate; cover films are adhered to the upper and lower sides of the flexible substrate; a protective film isattached to the outer side of the covering film; wherein the metal layers are pressed on the outer side of the rigid-flexible combined substrate, the metal layers are combined through prepregs, the metal layers and the rigid-flexible combined substrate are combined through prepregs, electrical connection holes are formed between the metal layers, between the metal layers and the rigid substrate and between the metal layers and the flexible substrate, and windows are formed in the upper side and the lower side of the flexible substrate and enable a covering film of the flexible substrate to beexposed. The invention further provides a manufacturing method of the rigid-flex printed circuit board. According to the invention, the processing difficulty is low, the interlayer bonding force is strong, the flexible substrate is embedded into the rigid substrate, the connectivity is good, and the cost of the flexible substrate is saved.
Description
technical field [0001] The invention relates to the technical field of circuit board production, in particular to a rigid-flex board and a manufacturing method thereof. Background technique [0002] A rigid-flexible printed circuit board refers to a printed circuit board that contains both one or more rigid areas and one or more flexible areas on a printed circuit board. It is used as a rigid board and a flexible board. A combination of both rigid and flexible boards. Since the flexible board has the characteristics of free bending, winding, and folding, products made of rigid-flexible printed circuit boards are easy to assemble and can be folded to form a better compact packaging form, thereby saving Eliminate the connection and installation of wires and cables, reduce the welding of connectors and terminals, reduce the space occupied by the product and the weight of the product, reduce electrical interference and improve electrical performance, and meet the requirements o...
Claims
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IPC IPC(8): H05K1/14H05K3/46
CPCH05K1/147H05K3/4691
Inventor 张东正林婷
Owner SHENZHEN HUALIN CIRCUIT TECH
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