Silicon wafer drying device and silicon wafer curing device
A technology of drying device and curing device, applied in drying, drying machine, drying of solid materials, etc., can solve the problems of high energy consumption and large floor space, and achieve the goal of reducing energy consumption, reducing area and ingenious design. Effect
Pending Publication Date: 2020-12-08
CFDR SHENZHEN TECH CO LTD
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[0004] In view of this, an embodiment of the present invention provides a drying device for silicon wafers and a curing device for silicon wafers, so as to solve the problems that the overall area of the drying device is large and the energy consumption is high
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[0025] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
[0026] The various specific technical features described in the specific embodiments can be combined in any suitable manner if there is no contradiction, for example, different embodiments and technical solutions can be formed by combining different specific technical features. In order to avoid unnecessary repetition, various possible combinations of specific technical features in the present invention will not be further described.
[0027] Such as figure 1 As shown, a silicon wafer drying device 1 provided by the embodiment of the present invention is mainly used in the production and use of si...
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The invention is applicable to the technical field of silicon wafer processing equipment, and provides a silicon wafer drying device and a silicon wafer curing device. The drying device comprises a furnace body and a conveying assembly, wherein an accommodating cavity is defined by the furnace body; the conveying assembly is used for stacking and placing silicon wafers and moving and conveying thesilicon wafers in preset directions; and the preset directions comprise a first direction, a second direction and a third direction which are connected in sequence, the first direction is a linear direction, and an included angle between the first direction and the vertical direction and an included angle between the third direction and the vertical direction are both smaller than or equal to 90degrees. The curing device comprises the drying device, a transporting assembly and a distribution assembly, wherein the transporting assembly comprises a plurality of transporting tables; and the distribution assembly is used for distributing the silicon wafers on the current transporting table to the next transporting table. According to the silicon wafer drying device and the silicon wafer curing device, the silicon wafers are stored in a stacked mode in the height direction, so that not only is the number of the silicon wafers stored in the furnace body increased, but also the overall occupied area is reduced; and meanwhile, the silicon wafers are concentrated to be heated and dried, therefore, the drying energy consumption is reduced, and energy conservation and environmental protection are achieved.
Description
technical field [0001] The invention belongs to the technical field of silicon wafer processing equipment, in particular to a drying device for silicon wafers and a curing device for silicon wafers. Background technique [0002] High-efficiency heterojunction solar cells are considered to be the mainstream technology for next-generation photovoltaic cells because they can receive light on both sides, and have the characteristics of low production process temperature, high conversion efficiency, low temperature coefficient, and double-sided power generation. Compared with traditional crystalline silicon cell components, the conversion efficiency of high-efficiency heterojunction solar cell components is about 10-20% higher, and the land area, brackets, cables, and labor required per unit of installed capacity are less, and the products have broad commercialization market expectation. [0003] During production, high-efficiency heterojunction solar cells need to be printed an...
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IPC IPC(8): F26B15/22F26B25/00F26B25/02H01L31/18
CPCF26B15/22F26B25/003F26B25/02H01L31/1864H01L31/1876
Inventor 谢建刘永才
Owner CFDR SHENZHEN TECH CO LTD