Bonding disc for wafer bonding and wafer bonding device

A wafer bonding and bonding technology, which is applied in the manufacture of electrical components, semiconductor/solid-state devices, circuits, etc., can solve problems such as burns, damage to vacuum components and seals, and achieve high heating efficiency, simple structure, and heat insulation good effect

Pending Publication Date: 2020-12-08
BEIJING U PRECISION TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] During the heating process of the bonded disk in the prior art, it is easy to conduct the temperature of the heating disk to the connecting part of the heating disk and the vacuum chamber
When the temperature of the heating plate reaches the bonding

Method used

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  • Bonding disc for wafer bonding and wafer bonding device
  • Bonding disc for wafer bonding and wafer bonding device
  • Bonding disc for wafer bonding and wafer bonding device

Examples

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[0024] In order to make the technical problems, technical solutions, and advantages to the present invention, the technical solutions and advantages will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0025] Bonding pad embodiment of the present invention provides a method for bonding a wafer 100, such as Figure 1-4 Shown, the bond pad 100 includes a platen 110 sequentially from the inside to the outside, graphite layer 120, heating plate 130, cooling coil 140 and the insulating layer 150, insulating layer 150 comprises a reflection screen 151 and substrate 152, substrate 152 is provided outside the reflection screen 151, the substrate 152 provided with a cooling medium circulation passage.

[0026] Bonding pad for wafer bonding according to the present invention is in use, the upper and lower bonding pads disposed symmetrically, two wafers are placed vertically between the two bond pads. Direction toward the inner side of the ...

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Abstract

The invention discloses a bonding disc for wafer bonding and a wafer bonding device, and belongs to the field of semiconductor wafer processing. The bonding disc for wafer bonding sequentially comprises pressing discs, a graphite layer, a heating disc, a cooling disc and a heat insulation layer from the inner side to the outer side, the heat insulation layer comprises a reflection screen and a base plate, the base plate is arranged on the outer side of the reflection screen, and a cooling medium circulation channel is arranged in the base plate. Heat of the heating disc can be uniformly conducted to the pressing discs through the graphite layer, and the parallelism error of the upper pressing disc and the lower pressing disc can be compensated. The heat insulation layer comprising the reflecting screen and the base plate well prevents heat of the heating disc from being conducted to components such as a connecting piece, the heat insulation effect is good, the heating efficiency of theheating disc is high, and the influence of the cooling effect of the base plate on heating of the heating disc is small. And moreover, the structure is simple.

Description

technical field [0001] The present invention relates to the field of semiconductor wafer processing, in particular to a bonding pad for wafer bonding and a wafer bonding device. Background technique [0002] As the application fields of wafer bonding technology become more and more extensive, temperature has gradually become one of the bottlenecks in the development of wafer bonding technology. Wafer bonding processes include fusion, anodic bonding, metal bonding, and polymer adhesive bonding. In these wafer bonding methods, two wafers need to be heated to fuse or diffuse the dielectric layers on the surface of the wafers. , and complete the pressing of two wafers together. [0003] A bonding plate for wafer bonding in the prior art is composed of a heating plate, a cooling plate and a pressure plate. The wafer bonding device uses two sets of upper and lower bonding plates, and the upper and lower bonding plates are arranged symmetrically. The following bonding plate is t...

Claims

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Application Information

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IPC IPC(8): H01L21/67
CPCH01L21/67103H01L21/67138H01L21/67248
Inventor 司伟白龙
Owner BEIJING U PRECISION TECH
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