Bonding disc for wafer bonding and wafer bonding device
A wafer bonding and bonding technology, which is applied in the manufacture of electrical components, semiconductor/solid-state devices, circuits, etc., can solve problems such as burns, damage to vacuum components and seals, and achieve high heating efficiency, simple structure, and heat insulation good effect
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[0024] In order to make the technical problems, technical solutions, and advantages to the present invention, the technical solutions and advantages will be described in detail below with reference to the accompanying drawings and specific embodiments.
[0025] Bonding pad embodiment of the present invention provides a method for bonding a wafer 100, such as Figure 1-4 Shown, the bond pad 100 includes a platen 110 sequentially from the inside to the outside, graphite layer 120, heating plate 130, cooling coil 140 and the insulating layer 150, insulating layer 150 comprises a reflection screen 151 and substrate 152, substrate 152 is provided outside the reflection screen 151, the substrate 152 provided with a cooling medium circulation passage.
[0026] Bonding pad for wafer bonding according to the present invention is in use, the upper and lower bonding pads disposed symmetrically, two wafers are placed vertically between the two bond pads. Direction toward the inner side of the ...
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