Cleaning and polishing equipment of special-shaped copper strip
A copper strip and special-shaped technology, which is applied in the field of cleaning and polishing equipment for special-shaped copper strips, can solve the problems of low polishing efficiency, high defective rate, and poor polishing quality of special-shaped copper strips, and achieves convenient equipment installation, sufficient oil supply, and uniform effect
Pending Publication Date: 2020-12-11
上海双张新材料科技有限公司 +1
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Problems solved by technology
[0003] In order to overcome the deficiencies in the prior art, the present invention provides a special-shaped copper strip cleaning and polishing equipment to solve the current problems of low polishing efficiency, poor polishing quality and high defective rate of special-shaped copper strips
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[0065] The technical solutions in the embodiments of the present invention will be clearly and completely described and discussed below in conjunction with the accompanying drawings of the present invention. Obviously, what is described here is only a part of the examples of the present invention, not all examples. Based on the present invention All other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.
[0066] Such as Figure 1-3 As shown, this embodiment discloses a special-shaped copper strip cleaning and polishing equipment, including a special-shaped copper strip transmission mechanism 1, a special-shaped surface polishing mechanism 2, an upper fixing frame 3, a bottom bracket 4, a polishing oil tank 5, and a flat surface polishing mechanism 6. in:
[0067] The bottom bracket 4 and the upper fixing frame 3 adopt square steel welding as the skeleton, and the bottom bracket 4 a...
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The invention discloses cleaning and polishing equipment for a special-shaped copper strip. The cleaning and polishing equipment comprises special-shaped copper strip conveying mechanisms, special-shaped surface polishing mechanisms, an upper fixing frame, a bottom support, a polishing oil groove and flat surface polishing mechanisms, wherein the bottom support and the upper fixing frame adopt square steel welding as a framework and are fixedly connected through screws; the special-shaped copper strip conveying mechanisms are arranged on the left side and the right side above the bottom support and fixed to the bottom support through bolts; the special-shaped surface polishing mechanisms are fixed to a back plate of the upper fixing frame, and the back plate is fixed to the upper fixing frame through bolts; the flat surface polishing mechanisms are fixed to the back plate of the upper fixing frame and are arranged obliquely below the special-shaped surface polishing mechanisms; and thepolishing oil groove is formed in the bottom support and fixed to the bottom support through bolts. The cleaning and polishing equipment for the special-shaped copper strip has the advantages of being reasonable in design, easy and convenient to operate, high in work efficiency, high in automation degree, high in polishing precision and not prone to damaging the copper strip, and has a guiding effect on special-shaped copper strip polishing machining.
Description
technical field [0001] This patent relates to the technical field of copper strip polishing and cleaning, in particular to a special-shaped copper strip cleaning and polishing equipment. Background technique [0002] The current polishing and cleaning technology of special-shaped copper strips adopts mechanical grinding and polishing, and special-shaped copper strips are used as the main carrier substrate of semiconductor plastic-encapsulated transistors. With the continuous development of electronic communication technology, the production and quality requirements of special-shaped copper strips are increasing High, the traditional special-shaped copper strip polishing and cleaning technology mainly uses polishing abrasives. The polishing abrasives will wear out and the polishing accuracy cannot be guaranteed. The traditional polishing technology has low efficiency and poor polishing quality and cannot meet the requirements of many semiconductor packages. In order to improv...
Claims
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Login to View More IPC IPC(8): B24B29/02B24B41/04B24B57/02
CPCB24B29/02B24B41/04B24B57/02
Inventor 张苗程道来王旭飞荆学东
Owner 上海双张新材料科技有限公司