A semiconductor graphite cutting device and cutting method thereof
A cutting device and semiconductor technology, applied in the direction of stone processing tools, stone processing equipment, work accessories, etc., can solve the problems of limited cutting angle, a large amount of dust, and the impact on the health of staff, and achieve the effect of increasing the service life
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Embodiment 1
[0029] see Figure 1-5 , a semiconductor graphite cutting device provided by an embodiment of the present invention includes a cutting mechanism 1, a collecting mechanism 2, a clamping mechanism 3, a base 4, a blade fixing mechanism 5 and a driving mechanism 6, and the clamping mechanism 3 is rotatably installed On the base 4, the cutting mechanism 1 is fixedly installed above the clamping mechanism 3, the collection mechanism 2 is fixedly arranged inside the clamping mechanism 3, and the blade fixing mechanism 5 is fixedly arranged on the clamping mechanism 3. On the cutting mechanism 1, the driving mechanism 6 is arranged on the base 4;
[0030] The blade fixing mechanism 5 includes a fixed seat 51, a first magnet 52, a second magnet 53, a return spring 54, a moving bar 55 and a third magnet 56, and the bottom end of the fixed seat 51 is provided with an opening, and the fixed seat 51 is provided with an opening. A storage cavity 511 is opened inside the 51, and the first m...
Embodiment 2
[0035] In the first embodiment, there is also the problem that the graphite plate cannot be cut at multiple angles. Therefore, on the basis of the first embodiment, this embodiment also includes: the drive mechanism 6 includes a first drive motor 61, a second drive motor 62. The first bevel gear 64 and the second bevel gear 65, the first driving motor 61 is fixedly arranged on the base 4, and the output end of the second driving motor 62 is connected to the rotating rod through a coupling 13. The first driving motor 61 is connected to the first bevel gear 64 through a coupling, the second bevel gear 65 is fixedly connected to the bottom end of the central rod 23, and the first bevel gear 64 is connected to the bottom end of the central rod 23. The second bevel gear 65 meshes with each other.
[0036] Described cutting mechanism 1 comprises fixed support 11, rotating disc 12, rotating rod 13, fixed rod 14 and cutting rod 15, and the two ends of described fixed support 11 are re...
Embodiment 3
[0039] In the second embodiment, there is also the problem that the waste generated by cutting cannot be collected. Therefore, on the basis of the second embodiment, this embodiment also includes: the collection mechanism 2 includes an upper rotating plate 21, a lower rotating plate 22, The central rod 23, the collection housing 24, the first connecting rod 25 and the second connecting rod 26, the collection housing 24 is a conical structure, the collection housing 24 is located in the middle of the first connecting rod 111, the The collecting case 24 is fixedly arranged in the support plate 31, and the inside of the collecting case 24 is provided with a locking groove, the upper rotating plate 21 is fixedly arranged on the central rod 23, and the lower rotating plate 22 It is rotatably arranged on the central rod 23, both ends of the upper rotating plate 21 and the lower rotating plate 22 are located in the clamping groove, and the upper rotating plate 21 is provided with a nu...
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