Semiconductor chip coating device
A coating device and semiconductor technology, which is used in semiconductor/solid-state device manufacturing, sputtering coating, ion implantation coating, etc., can solve the problems of high vacancy rate and complicated transfer device, and achieves improved efficiency, easy maintenance, and reduced vacancy. rate effect
Active Publication Date: 2020-12-11
湖南辰皓真空科技有限公司
View PDF6 Cites 1 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0004] The purpose of the present invention is to provide a semiconductor chip coating device in order to solve the problems of high vacancy rate and complicated transfer device in the existing semiconductor chip coating device
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0022] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0023] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" etc. The indicated orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred d...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention discloses a semiconductor chip coating device, and relates to the technical field of semiconductor chip coating. The semiconductor chip coating device comprises a base. A hydraulic rod is arranged in the base, and a lifting guide block penetrating through the top of the base is arranged at the top of the hydraulic rod. A lifting tackle is matched with the hydraulic rod, so that the lifting guide block rises, a jacking column is lifted along a slope when passing by the lifting guide block, a coating disc is supported from the top of a coating frame through a supporting ring, so that the coating disc lifting process is rapidly completed, an existing complex transfer mechanical arm is replaced in a simple and effective mode, and simple structure and maintenance are realized; andthrough a coating frame sliding rail, a coating cabin sliding cover and an inlet turning cover, a coating cabin allows entry on the front side and exit on the rear side, the coating disc where coating is completed is conveyed into a lifting pipeline through the coating frame, meanwhile, a feeding mechanical arm prepares a new coating disc to the position above a coating frame reset position through the inlet turning cover, feeding can be completed after the coating frame returns, the vacancy rate is reduced, and thus the efficiency is greatly improved.
Description
technical field [0001] The invention relates to the technical field of semiconductor chip coating, in particular to a semiconductor chip coating device. Background technique [0002] Semiconductor chips are ubiquitous. Almost all digital appliances such as computers and mobile phones are inseparable from semiconductor chips. Modern computing, communication, manufacturing and transportation systems, including the Internet, all rely on the existence of semiconductor chips. [0003] Coating is an important part in the production of semiconductor chips. Most of the current coating devices use vacuum coating technology. In the prior art, mechanical arms are used to work with vacuum coating machines. The coating disc inside the machine is taken out, and then the new coating disc is put into the interior through the mechanical arm after transfer. The waiting time in the middle is long and the vacancy rate is high, resulting in low efficiency. In addition, the existing transfer devi...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/22H01L21/67
CPCC23C14/22H01L21/67011
Inventor 吴盛春范晓君袁建锋陈茂彬黄钦亮
Owner 湖南辰皓真空科技有限公司